TZA3019AV PHILIPS [NXP Semiconductors], TZA3019AV Datasheet - Page 22

• Manufacturer Part Number: TZA3019AV
• Description: 2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
BONDING PAD LOCATIONS
2000 Apr 10
GND1A
IN1
IN1Q
GND1A
n.c.
n.c.
GND2A
IN2
IN2Q
GND2A
V
LOSTH1
LOSTH2
n.c.
LEVEL1
LEVEL2
VREF
n.c.
TEST
V
GND2B
OUT2Q
SYMBOL
EE2A
EE2B
2.5 Gbits/s dual postamplifier with level
detectors and 2
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
PAD
2 switch
+79
+236
+393
+550
+707
+928
+928
928
928
928
928
928
928
928
928
928
928
707
550
393
236
79
COORDINATES
x
+710
+553
+396
+239
+81
81
239
396
553
710
928
928
928
928
928
928
928
928
928
928
710
553
y
(1)
22
Note
1. All x and y coordinates represent the position of the
OUT2
GND2B
n.c.
n.c.
GND1B
OUT1Q
OUT1
GND1B
V
RSSI2
LOS2
RSSI1
LOS1
INV2
INV1
S2
S1
V
EE1B
EE1A
SYMBOL
centre of the pad in m with respect to the centre of the
die (see Fig.15)
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
PAD
+928
+928
+928
+928
+928
+928
+928
+928
+707
+550
+393
+236
+79
79
236
707
Preliminary specification
COORDINATES
x
TZA3019
+81
+239
+396
+553
+710
+928
+928
+928
+928
+928
+928
+928
+928
+928
+928
396
239
81
y
(1)