TZA3019AV PHILIPS [NXP Semiconductors], TZA3019AV Datasheet - Page 20

• Manufacturer Part Number: TZA3019AV
• Description: 2.5 Gbits/s dual postamplifier with level detectors and 2 x 2 switch
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
2000 Apr 10
handbook, full pagewidth
2.5 Gbits/s dual postamplifier with level
detectors and 2
In order to enable heat flow out of the package, the following measures have to be taken:
(1) Solder the 3
(2) Add a plane with minimum 200 mm
(3) Use maximum amount of vias to connect two planes.
(4) Use minimum of openings in heat transport area between hot plane and ground planes.
3 mm
2
die pad to a plane with maximum size.
To central
V EE decoupling
0603
GND1A
IN2Q
GND2A
IN1Q
GND2A
0
GND1A
IN1
IN2
To central
V EE decoupling
2 switch
0603
0603
1
2
in an inner layer, surrounded by ground layers.
Fig.13 PCB layout for negative supply voltage.
0603
Boundary of 200 mm
2
0603
0603
0603
0603
3
0603
4
0603
0603
0603
0603
2
area
5 mm
20
To central
V EE decoupling
To central
V EE decoupling
HTQFP
0603
0603
GND1B
OUT1
GND1B
GND2B
OUT2
GND2B
OUT1Q
OUT2Q
Preliminary specification
TZA3019
MGS567