M24C01-x STMICROELECTRONICS [STMicroelectronics], M24C01-x Datasheet - Page 7
M24C01-x
Manufacturer Part Number
M24C01-x
Description
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
1.M24C01-X.pdf
(37 pages)
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M24C08-x M24C04-x M24C02-x M24C01-x
Caution:
Figure 2.
1. NC = Not connected
2. See
3. The Ei inputs are not decoded, and are therefore decoded as “0” (See
Figure 3.
1. See
EEPROM dice delivered in wafer form or in WLCSP package by STMicroelectronics must
never be exposed to ultra violet (UV) light, since EEPROM cells loose their charge (and so
their binary value) when exposed to UV light.
E2)
the Ei input is decoded as "0" (see also
for more information).
Section 7: Package mechanical data
Figure 2: 8-pin package connections (top
8-pin package connections (top view)
WLCSP and thin WLCSP connections
(top view, marking side, with balls on the underside)
Doc ID 5067 Rev 18
Section 2.3: Chip Enable (E0, E1,
for package dimensions, and how to identify pin-1.
SCL
WC
view). The Ei inputs are not connected to a ball, therefore
SDA
V
V
CC
SS
Section 2.3: Chip Enable (E0, E1,
E2))
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Description
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