M24C01-x STMICROELECTRONICS [STMicroelectronics], M24C01-x Datasheet - Page 32

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M24C01-x

Manufacturer Part Number
M24C01-x
Description
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
Part numbering
8
32/37
Part numbering
Table 22.
1. Only M24C08-x and Root Part Number 1 devices are offered in the WLCSP package.
2. Only M24C08-x-F devices are offered in the Thin WLCSP package.
For a list of available options (speed, package, etc.) or for further information on any aspect
of this device, please contact your nearest ST sales office.
Example:
Device type
M24 = I
Device Function
08 = 8 Kbit (1024 x 8)
04 = 4 Kbit (512 x 8)
02 = 2 Kbit (256 x 8)
01 = 1 Kbit (128 x 8)
Operating voltage
W = V
R = V
F = V
Package
BN = PDIP8
MN = SO8 (150 mil width)
MB or MC= UFDFPN8 (MLP8)
DW = TSSOP8 (169 mil width)
CS = WLCSP
CT = Thin WLCSP
Device grade
6 = Industrial: device tested with standard test flow over –40 to 85 °C
5 = Consumer: device tested with standard test flow over –20 to 85 °C.
Option
T = Tape and reel packing
Plating technology
P = ECOPACK
Process
/S = Manufacturing technology code
CC
CC
CC
2
C serial access EEPROM
= 1.7 V to 5.5 V (400 kHz)
= 1.8 V to 5.5 V (400 kHz)
= 2.5 V to 5.5 V (400 kHz)
Ordering information scheme
(1)
®
(Chip scale package)
(RoHS compliant)
(2)
(Chip scale package)
Doc ID 5067 Rev 18
M24C01
M24C08-x M24C04-x M24C02-x M24C01-x
W DW 3
T
P /S

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