UJA1069TW24 NXP [NXP Semiconductors], UJA1069TW24 Datasheet - Page 58

• Manufacturer Part Number: UJA1069TW24
• Description: LIN fail-safe system basis chip
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
12. Package outline
Fig 27. Package outline SOT549-1 (HTSSOP32)
UJA1069_3
Product data sheet
HTSSOP32: plastic thermal enhanced thin shrink small outline package; 32 leads;
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
DIMENSIONS (mm are the original dimensions).
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
VERSION
OUTLINE
SOT549-1
max.
32
1.1
1
A
Z
y
pin 1 index
0.15
0.05
A 1
0.95
0.85
A 2
IEC
0.25
A 3
exposed die pad side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
MO-153
JEDEC
11.1
10.9
D
(1)
Rev. 03 — 10 September 2007
REFERENCES
0
D h
5.1
4.9
E
6.2
6.0
b
(2)
p
JEITA
scale
17
16
2.5
E h
3.6
3.4
w
c
M
0.65
e
A 2
5 mm
A 1
H E
8.3
7.9
L
1
0.75
0.50
L p
H E
LIN fail-safe system basis chip
E
PROJECTION
EUROPEAN
detail X
0.2
v
L
L
0.1
p
w
UJA1069
© NXP B.V. 2007. All rights reserved.
(A 3 )
0.1
y
A
ISSUE DATE
03-04-07
05-11-02
0.78
0.48
X
Z
SOT549-1
A
v
M
8
0
o
58 of 64
o
A