MCZ33784EF/R2- FREESCALE [Freescale Semiconductor, Inc], MCZ33784EF/R2- Datasheet - Page 4

• Manufacturer Part Number: MCZ33784EF/R2-
• Description: DSI 2.02 Sensor Interface
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Table 2. Maximum Ratings
malfunction or permanent damage to the device.
4
33784
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL RATINGS
THERMAL RATINGS
THERMAL RESISTANCE AND PACKAGE DISSIPATION RATINGS
Notes
I /O0, I/O1, I/O2, AN0, AN1, TEST1, TEST2, TOUT Voltage
I /On, ANn, TESTn, TOUT Pin Current
BUSOUT Voltage, BUS SW = open
BUSIN Voltage, BUS SW = open
RTNOUT Voltage, BUS SW = open
H_CAP Voltage
BUSIN, BUSOUT, and H_CAP Current (Continuous)
BUSIN, RTNIN, reverse current (max 5 ms)
RTNIN, RTNOUT Current
IDDQ Voltage
V
ESD Voltage
Storage Temperature
Operating Ambient Temperature
Operating Junction Temperature
Resistance, Junction-to-Ambient (Single Layer (1s) PCB Board)
Resistance, Junction-to-Board (Multi-Layer (2s2P) PCB Board)
Peak Package Reflow Temperature During Reflow
All voltages are with respect to Analog Ground (AGND) unless otherwise noted. Exceeding these ratings may cause a
REG
1.
2.
3.
Human Body Model (HBM)
Machine Model (MM)
Charge Device Model (CDM)
Range
Corner pins
All other pins
ESD1 testing is performed in accordance with the Human Body Model (HBM) (C
performed in accordance with the Machine Model (MM) (C
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow
Temperature and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes
and enter the core ID to view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
(1)
Ratings
ELECTRICAL CHARACTERISTICS
(2)
,
(3)
MAXIMUM RATINGS
ZAP
= 200pF, R
ZAP
= 0Ω); and Charge Body Model (CBM)
Symbol
I
I
BUSRTN
T
V
V
ZAP
REVLK
R
R
V
V
PPRT
V
V
V
V
IDDQ
T
I
I
ESD
T
T
θ
θ
IO
IN
RO
IO
IN
IN
IN
IN
S
A
J
JA
JB
= 100pF, R
Analog Integrated Circuit Device Data
-0.3 to V
ZAP
-55 to 150
-40 to 125
-40 to 150
-0.3 to 40
-0.3 to 40
-14 to 40
-14 to 25
0.3 - 7.0
= 1500Ω), ESD2 testing is
±2000
Value
Note 3
REGOUT
±200
±750
±500
2.75
400
400
400
125
5.0
62
Freescale Semiconductor
+ 0.3
°C/W
°C/W
Unit
mA
mA
mA
mA
°C
°C
°C
°C
V
V
V
V
V
V
V
V