KM681000 SAMSUNG [Samsung semiconductor], KM681000 Datasheet
KM681000
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KM681000 Summary of contents
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... A 11 GENERAL DESCRIPTION The KM681000B family is fabricated by SAMSUNG's advanced CMOS process technology. The family can support various operating temperature ranges and have various package types for user flexibility of system design. The family also support low data retention voltage for battery back-up operation with low data retention current ...
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... KM681000B Family PRODUCT LIST & ORDERING INFORMATION PRODUCT LIST Commercial Temp Product (0~70 ¡É ) Part Name Function KM681000BLP-5 32-DIP,55ns,L-pwr KM681000BLP-5L 32-DIP,55ns,LL-pwr KM681000BLP-7 32-DIP,70ns,L-pwr KM681000BLP-7L 32-DIP,70ns,LL-pwr KM681000BLG-5 32-SOP,55ns,L-pwr KM681000BLG-5L 32-SOP,55ns,LL-pwr KM681000BLG-7 32-SOP,70ns,L-pwr KM681000BLG-7L 32-SOP,70ns,LL-pwr ...
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... KM681000B Family ABSOLUTE MAXIMUM RATINGS Item Voltage on any pin relative to Vss Voltage on Vcc supply relative to Vss Power Dissipation Storage temperature Operating Temperature Soldering temperature and time * Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stres s rating only and functional operation of the device at these or any other conditions above those indicated in the operating section of this specification is not implied ...
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... KM681000B Family DC AND OPERATING CHARACTERISTICS Item Input leakage current Output leakage current Operating power supply current Average operating current Output low voltage Output high voltage Standby Current(TTL) KM681000BL KM681000BL-L Standby KM681000BLE Current (CMOS) KM681000BLE-L KM681000BLI KM681000BLI ¡É , Vcc=5.0V ¡¾ 10%, unless otherwise specified ...
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... KM681000B Family TEST CONDITIONS (2. Temperature and Vcc Conditions) Product Family Temperature KM681000BL/L-L KM681000BLE/LE-L KM681000BLI/LI-L PARAMETER LIST FOR EACH SPEED BIN Parameter List Read Read cycle time Address access time Chip select to output Output enable to valid output Chip select to low-Z output Output enable to low-Z output ...
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... KM681000B Family DATA RETENTION CHARACTERISTICS Item Vcc for data retention V DR Data retention current I DR Data retention set-up time t RDR Recovery time t RDR = ¡É , unless otherwise specified * 1) Commercial Product : ¡É , unless otherwise specified 2) Extended Product : ¡É , unless otherwise specified ...
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... KM681000B Family TIMMING DIAGRAMS TIMING WAVEFORM OF READ CYCLE (1) (CS =OE WE Address Data Out Previous Data Valid TIMING WAVEFORM OF READ CYCLE Address Data out High-Z NOTES (READ CYCLE and OHZ are defined as the time at which the outputs achieve the open circuit conditions and are not referenced to output voltage le vels. ...
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... KM681000B Family TIMING WAVEFORM OF WRITE CYCLE (1) Address Data in Data out TIMING WAVEFORM OF WRITE CYCLE (2) Address Data in Data out (WE Controlled CW( CW(2) t AS(3) t WHZ Data Undefined (CS Controlled AS(3) CW( High-Z PRELIMINARY CMOS SRAM t ) WR1(4 t WP( ...
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... KM681000B Family TIMING WAVEFORM OF WRITE CYCLE (2) Address CS1 CS2 WE Data in Data out NOTES (WRITE CYCLE write occurs during the overlap of low CS going low. A write ends at the earliest transition among CS to the end of write measured from the later ...
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... KM681000B Family PACKAGE DIMENSIONS 32 DUAL INLINE PACKAGE (600mil) #32 ¡¾ 13.60 0.20 ¡¾ 0.535 0.008 #1 1. 0.075 32 PLASTIC SMALL OUTLINE PACKAGE (525mil) # 0.028 42.31 MAX 1.666 ¡¾ 4.191 0.20 ¡¾ 1.650 0.008 ¡¾ 0.46 0.10 ¡¾ 0.018 0.004 1.52 ¡¾ 0.10 ¡¾ ...
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... KM681000B Family PACKAGE DIMENSIONS 32 THIN SMALL OUTLINE PACKAGE TYPE I (0820F) +0.10 0.20 -0.05 +0.004 0.008 -0.002 #1 0.50 0.0197 #16 0.25 TYP 0.010 0~8 ¡É 0.45 ~0.75 0.018 ~0.030 32 THIN SMALL OUTLINE PACKAGE TYPE I (0820R) +0.10 0.20 -0.05 +0.004 0.008 -0.002 #16 0.50 0.0197 #1 0.25 TYP 0.010 0~8 ¡É 0.45 ~0.75 0.018 ~0.030 ¡¾ 20.00 0.20 ¡¾ 0.787 0.008 ¡ ...