MPC8347 FREESCALE [Freescale Semiconductor, Inc], MPC8347 Datasheet - Page 92

• Manufacturer Part Number: MPC8347
• Description: Integrated Host Processor Hardware Specifications
• Manufacturer: FREESCALE [Freescale Semiconductor, Inc]

Thermal
20 Thermal
This section describes the thermal specifications of the MPC8347EA.
20.1
Table 64
Table 65
92
Junction-to-ambient natural convection on single layer board (1s)
Junction-to-ambient natural convection on four layer board (2s2p)
Junction-to-ambient (@200 ft/min) on single layer board (1s)
Junction-to-ambient (@ 200 ft/min) on four layer board (2s2p)
Junction-to-board thermal
Junction-to-case thermal
Junction-to-ambient natural convection on single-layer board (1s)
Junction-to-ambient natural convection on four-layer board (2s2p)
Junction-to-ambient (@200 ft/min) on single-layer board (1s)
Junction-to-ambient (@ 200 ft/min) on four-layer board (2s2p)
Junction-to-ambient (@ 2 m/s) on single-layer board (1s)
Junction-to-ambient (@ 2 m/s) on four-layer board (2s2p)
Junction-to-board thermal
Junction-to-case thermal
Junction-to-package natural convection on top
Notes
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal, 1 m/s is approximately equal to 200 linear feet per minute (LFM).
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883 Method
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
the top surface of the board near the package.
1012.1).
per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written as Psi-JT.
provides the package thermal characteristics for the 672 35 × 35 mm TBGA of the MPC8347EA.
provides the package thermal characteristics for the 620 29 × 29 mm PBGA of the MPC8347EA.
Thermal Characteristics
MPC8347EA PowerQUICC II Pro Integrated Host Processor Hardware Specifications, Rev. 3
Characteristic
Table 64. Package Thermal Characteristics for TBGA
Table 65. Package Thermal Characteristics for PBGA
Characteristic
Symbol
R
R
R
R
R
R
Symbol
θJMA
θJMA
θJMA
R
R
R
R
R
θJB
θJC
R
R
R
θJA
ψ
θJMA
θJMA
θJMA
θJMA
θJMA
θJA
θJB
θJC
JT
Value
Value
21
15
17
12
6
5
3.8
1.7
14
11
11
8
9
7
1
Freescale Semiconductor
°C/W
°C/W
°C/W
•C/W
•C/W
•C/W
°C/W
°C/W
°C/W
Unit
•C/W
•C/W
•C/W
•C/W
•C/W
•C/W
Unit
Notes
Notes
1, 2
1, 3
1, 3
1, 3
1, 3
1, 3
1, 2
1, 3
1, 3
1, 3
4
5
6
4
5