XE88LC01MI000 ETC1 [List of Unclassifed Manufacturers], XE88LC01MI000 Datasheet - Page 35

• Manufacturer Part Number: XE88LC01MI000
• Description: Sensing Machine 16 + 10 bit Data Acquisition Ultra Low-Power Microcontroller
• Manufacturer: ETC1 [List of Unclassifed Manufacturers]

9.3 Die form
9.3.1 Bonding pads location
Table 9.1:
35
Figure 9.3:
Symbol
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
1
2
3
4
5
6
7
8
9
AC_R(3)
PA(4)
PA(5)
PA(6)
PA(7)
PC(0)
PC(1)
PC(2)
PC(3)
PC(4)
PC(5)
PC(6)
PC(7)
PB(0)
PB(1)
PB(2)
PB(3)
PB(4)
PB(5)
PB(6)
PB(7)
TEST
Pad
NC
NC
NC
NC
Coordinates start with a point near to the bottom left border (with respect to above picture). X
is horizontal, Y is vertical.
Pad size is 85 x 85 um.
Bonding pads location. Do not connect pads named NC. Connect Vss pad and substrate to Vss.
XE88LC01 in die: 4.1 x 4.6 mm
pin 1
1063.5
1198.5
1328.5
1463.5
1934.1
2394.1
2854.1
398.5
533.5
668.5
798.5
933.5
52.6
52.6
52.6
52.6
52.6
52.6
52.6
52.6
52.6
52.6
52.6
52.6
52.6
52.6
um
X
4075.5
3795.5
3515.5
3235.5
2955.5
2675.5
2395.5
2115.5
1835.5
1555.5
1275.5
995.5
715.5
435.5
47.6
47.6
47.6
47.6
47.6
47.6
47.6
47.6
47.6
47.6
47.6
47.6
um
Y
2
Symbol
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
AC_R(2)
AC_A(7)
AC_A(6)
AC_A(5)
AC_A(4)
AC_A(3)
AC_A(2)
AC_A(1)
AC_A(0)
AC_R(1)
AC_R(0)
RESET
OscOut
Vmult
OscIn
PA(0)
PA(1)
PA(2)
PA(3)
Pad
Vbat
Vreg
Vss
NC
NC
NC
NC
3314.1
3958.4
3958.4
3958.4
3958.4
3958.4
3958.4
3958.4
3958.4
3958.4
3958.4
3958.4
3958.4
3958.4
3597.6
3332.6
3067.6
2802.6
2537.0
2007.6
1742.6
1477.6
1212.6
947.6
682.6
417.6
um
X
Data Sheet XE88LC01
Data Acquisition Microcontroller
1092.4
1377.4
1662.4
1947.4
2232.4
2517.4
2802.4
3087.4
3372.4
3657.4
3942.4
4453.4
4453.4
4453.4
4453.4
4453.4
4453.4
4453.4
4453.4
4453.4
4453.4
4453.4
4453.4
522.4
807.4
47.6
um
Y
D0202-60