SAF7115ET NXP [NXP Semiconductors], SAF7115ET Datasheet - Page 13

• Manufacturer Part Number: SAF7115ET
• Description: Multistandard video decoder with super-adaptive comb filter,
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
7. Limiting values
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
All ground pins connected together and grounded (0 V); all supply pins connected together.
[1]
[2]
[3]
8. Thermal characteristics
SAF7115_1
Product data sheet
Symbol
V
V
V
V
V
V
V
V
V
T
T
V
V
stg
amb
DDA0
DDA1
DDA2
DDA(XTAL)
DDD(CORE)
DDD(IO)
I(a)
i
I(D)
esd
SS
Condition for maximum voltage at digital inputs or I/O pins: 3.0 V < V
Class 2 according to EIA/JESD22-114 .
Class C3B according to AEC-Q100-011 .
Limiting values
Parameter
analog supply voltage 0
analog supply voltage 1
analog supply voltage 2
crystal analog supply voltage
core digital supply voltage
I/O digital supply voltage
analog input voltage
input voltage
digital input voltage
ground supply voltage
difference
storage temperature
ambient temperature
electrostatic discharge
voltage
Table 6.
[1]
[2]
Symbol
R
th(j-a)
The overall R
and ground pins must be connected to the power and ground layers directly and use maximum areas for
power and ground planes in the application PCB.
In order to meet the specified R
to the ground layer of the application PCB.
The overall R
and ground pins must be connected to the power and ground layers directly and use maximum areas for
power and ground planes in the application PCB.
The R
at the center of the package (large ground area). This calculation assumes 80 % coverage for power and
ground metal layers and a natural convection flow at top and bottom sides of the PCB.
Maximum ball temperature then is 110 C, assuming ambient temperature T
th(j-a)
Parameter
thermal resistance from junction to ambient in free air
Thermal characteristics
value is calculated for a 4 layer PCB (100
th(j-a)
th(j-a)
value can vary depending on the board layout. To minimize the effective R
value can vary depending on the board layout. To minimize the effective R
Conditions
for CGC1 and CGC2
for analog inputs AI1x
for analog inputs AI2x
at pins XTALI, SDA and SCL
outputs in 3-state
human body model, all pins
charged device model, corner pins
charged device model, all other pins
Rev. 01 — 15 October 2008
th(j-a)
value the exposed die pad of the package has to be soldered directly
DDD
< 3.6 V.
100 mm
Conditions
SAF7115ET
SAF7115HW
2
) with at least 50 plated through-hole-vias
[1]
[2]
[3]
[3]
Multistandard video decoder
Min
-
-
-
-
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
65
40
amb(max)
[1]
[2]
SAF7115
© NXP B.V. 2008. All rights reserved.
Typ
23
35
= 85 C.
Max
+4.6
+4.6
+4.6
+4.6
+4.6
+4.6
+4.6
V
+4.6
+5.5
100
+150
+85
2000
750
500
DDx
th(j-a)
th(j-a)
+ 0.5 V
Unit
K/W
K/W
all power
all power
13 of 35
Unit
V
V
V
V
V
V
V
V
V
mV
V
V
V
C
C