TDA9935HW NXP [NXP Semiconductors], TDA9935HW Datasheet - Page 14

• Manufacturer Part Number: TDA9935HW
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
12. Package outline
Fig 11. Package outline SOT841-1 (HTQFP80)
TDA9935_4
Product data sheet
HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body 12 x 12 x 1 mm; exposed die pad
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included
UNIT
mm
E
SOT841-1
OUTLINE
VERSION
h
max
1.2
A
61
80
0.15
0.05
y
60
A
1
1
1.05
0.95
e
A
2
pin 1 index
exposed die pad
IEC
0.25
A
3
0.27
0.17
b
b
p
p
H
D
D
D
h
0.20
0.09
w
c
M
MS-026
JEDEC
12.1
11.9
D
(1)
0
REFERENCES
6.05
5.95
D
Rev. 04 — 17 September 2007
h
41
20
Z
12.1
11.9
E
D
(1)
40
21
JEITA
6.05
5.95
E
Dual 14-bit, up to 160 Msample/s, 2
X
scale
h
Z
5
E
B
b
0.5
e
w
p
e
c
v
v
M
M
M
14.15
13.85
H
A
B
A
E
D
H
14.15
13.85
E
H
E
10 mm
A
L
1
A
2
A
0.75
0.45
L
1
p
PROJECTION
EUROPEAN
0.2
v
detail X
0.08
w
0.1
y
TDA9935
interpolating DAC
© NXP B.V. 2007. All rights reserved.
Z
1.45
1.05
D
ISSUE DATE
(1)
L
04-01-15
L
Z
p
1.45
1.05
E
(1)
SOT841-1
(A
3
)
7
0
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