TDA9935HW NXP [NXP Semiconductors], TDA9935HW Datasheet
TDA9935HW
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TDA9935HW Summary of contents
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TDA9935 Dual 14-bit 160 Msample/s, 2 Digital-to-Analog Converter (DAC) Rev. 04 — 17 September 2007 1. General description The TDA9935 is optimized to reduce architecture complexity and overall system cost. Thanks to its direct IF conversion capabilities, it ...
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... NXP Semiconductors 4. Ordering information Table 1. Type number TDA9935HW 5. Block diagram (1) Pins 1, 3, 61, 65, 76 and 80. (2) Pins 4, 7, 62, 64, 66, 67, 70, 71, 74, 75, 77 and 79. (3) Pins 9, 17, 25, 29, 30, 35, 44, 49, 50, 52, 53, 54, 55 and 56. (4) Pins 18, 26, 36, 43, 63 and 78. Fig 1. Block diagram TDA9935_4 Product data sheet ...
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... Symbol V CCA i.c. V CCA AGND CLK CLKN AGND i.c. DGND TDA9935_4 Product data sheet Dual 14-bit 160 Msample TDA9935HW 11 I13 I12 12 I11 13 14 I10 15 I9 DGND Pin description [1] Pin Type Description 1 S analog supply voltage ...
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NXP Semiconductors Table 2. Symbol V CCD I13 I12 I11 I10 I9 I8 DGND DEC DGND DEC I1 I0 DGND DGND Q13 Q12 Q11 Q10 DGND DEC DEC ...
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NXP Semiconductors Table 2. Symbol V CCD DGND DGND DGND DGND DGND GAPD GAPOUT QVIRES IVIRES V CCA AGND DEC AGND V CCA AGND AGND QOUTN QOUT AGND AGND IOUTN IOUT AGND AGND V CCA AGND DEC AGND V CCA ...
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NXP Semiconductors 7. Functional description The DAC is a segmented architecture composed of a 7-bit thermometer sub-DAC, and the remaining 7-bit in a binary weighted sub-DAC. The device produces two complementary current outputs on both channels, respectively pins IOUT/IOUTN and ...
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NXP Semiconductors 8. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V digital supply voltage CCD V analog supply voltage CCA V supply voltage difference between CCA-CCD the analog and ...
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NXP Semiconductors 10. Characteristics Table 5. Characteristics 3 3.6 V; AGND and DGND connected together; T CCD CCA 3 and T CCD CCA O(FS) Figure ...
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NXP Semiconductors Table 5. Characteristics …continued 3 3.6 V; AGND and DGND connected together; T CCD CCA 3 and T CCD CCA O(FS) Figure 10; ...
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NXP Semiconductors Table 5. Characteristics …continued 3 3.6 V; AGND and DGND connected together; T CCD CCA 3 and T CCD CCA O(FS) Figure 10; ...
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NXP Semiconductors 20 output (dB 100 140 180 0 0.2 0.4 normalized frequency (f Fig 6. FIR filter frequency response Table 7. Coefficient H(1) H(2) H(3) H(4) H(5) H(6) H(7) H(8) H(9) H(10) H(11) H(12) H(13) H(14) H(15) ...
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NXP Semiconductors 11. Application information CCA 1 k CLKN 100 AGND 001aab126 Fig 8. Single-ended clock schematic TDA9935_4 Product data sheet Dual 14-bit 160 Msample/s, 2 TDA9935 CLK Fig 9. ...
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NXP Semiconductors AGND 3 CCA 1 3 CCA 3 3 ...
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NXP Semiconductors 12. Package outline HTQFP80: plastic thermal enhanced thin quad flat package; 80 leads; body mm; exposed die pad y exposed die pad pin 1 index ...
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NXP Semiconductors 13. Abbreviations Table 8. Acronym BW BWA CDMA EDGE FIR IF LMDS LSB MSB PLL PMOS SFDR WCDMA WLL 14. Glossary 14.1 Static parameters DNL — Differential Non-Linearity. The difference between the ideal and the measured output value ...
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NXP Semiconductors THD — Total Harmonic Distortion. The ratio of the RMS value of the harmonics of the output frequency to the RMS value of the output sine wave. Usually, the calculation of THD is done on the first 5 ...
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NXP Semiconductors 16. Legal information 16.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualification Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...
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NXP Semiconductors 18. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...