PCF8531U2D NXP [NXP Semiconductors], PCF8531U2D Datasheet - Page 6
PCF8531U2D
Manufacturer Part Number
PCF8531U2D
Description
34 x 128 pixel matrix driver Single-chip LCD controller and driver
Manufacturer
NXP [NXP Semiconductors]
Datasheet
1.PCF8531U2D.pdf
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NXP Semiconductors
PCF8531
Product data sheet
6.2 Pin description
Table 4.
[1]
Table 5.
All x/y coordinates represent the position of the center of each pad with respect to the center
(x/y = 0) of the chip (see
Pad
pad pitch (minimum)
bump dimensions
wafer thickness (excluding bumps)
die size L × W
Symbol
-
-
-
-
-
-
-
-
-
-
-
-
-
-
OSC
V
Fig 4.
LCDSENSE
Die size including saw lane of 70 μm.
Chip dimensions
Bonding pad dimensions
Bonding pad description
All information provided in this document is subject to legal disclaimers.
Pad
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Figure
W
Rev. 6 — 16 May 2011
3449.5
X (μm)
5973.6
5969.5
5899.5
5829.5
5479.5
5409.5
5059.5
4989.5
4639.5
4569.5
4219.5
4149.5
3799.5
3729.5
3169.5
Y
2).
X
Y (μm)
−821.7
823.4
823.4
823.4
823.4
823.4
823.4
823.4
823.4
823.4
823.4
823.4
823.4
823.4
823.4
823.4
PCF8531
L
oscillator input
voltage multiplier regulation input (V
Description
dummy
Size
70
50 × 90 × 17.5 (±3)
381
12.14 × 1.86
pitch
001aag908
34 x 128 pixel matrix driver
[1]
PCF8531
© NXP B.V. 2011. All rights reserved.
Unit
μm
μm
μm
mm
LCD
)
6 of 51
[1]
[2]
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