APA075-BGB ACTEL [Actel Corporation], APA075-BGB Datasheet - Page 3
APA075-BGB
Manufacturer Part Number
APA075-BGB
Description
ProASIC Flash Family FPGAs
Manufacturer
ACTEL [Actel Corporation]
Datasheet
1.APA075-BGB.pdf
(174 pages)
- Current page: 3 of 174
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Device Resources
General Guideline
Maximum performance numbers in this datasheet are based on characterized data. Actel does not guarantee
performance beyond the limits specified within the datasheet.
Device
APA075
APA150
APA300
APA450
APA600
APA750
APA1000
Notes:
1. Package Definitions: TQFP = Thin Quad Flat Pack, PQFP = Plastic Quad Flat Pack, PBGA = Plastic Ball Grid Array, FBGA = Fine Pitch Ball Grid
2. Each pair of PECL I/Os is counted as one user I/O.
3. FG256 and FG484 are footprint-compatible packages.
4. Military Temperature Plastic Package Offering
5. FG896 and FG1152 are footprint-compatible packages.
Array, CQFP = Ceramic Quad Flat Pack, CCGA = Ceramic Column Grid Array, LGA = Land Grid Array
100-Pin
TQFP
66
66
144-Pin
TQFP
107
208-Pin
PQFP
158
158
158
158
158
158
158
4
4
4
456-Pin
Commercial/Industrial
PBGA
290
356
356
242
344
356
4
4
4
144-Pin
FBGA
100
100
100
100
4
256-Pin
186
186
FBGA
186
186
User I/Os
3, 4
3, 4
3
3
v5.7
484-Pin
FBGA
344
370
2
3
3
676-Pin
FBGA
454
454
896-Pin
642
FBGA
562
4, 5
5
1152-Pin
FBGA
712
ProASIC
5
208-Pin
CQFP
Military/MIL-STD-883B
PLUS
158
158
158
Flash Family FPGAs
352-Pin
CQFP
248
248
248
624-Pin
CCGA/
LGA
440
440
iii
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