UPD70208HGF-16-3B9 NEC, UPD70208HGF-16-3B9 Datasheet - Page 104
UPD70208HGF-16-3B9
Manufacturer Part Number
UPD70208HGF-16-3B9
Description
V40HLTM/ V50HLTM 16/8/ 16-BIT MICROPROCESSOR
Manufacturer
NEC
Datasheet
1.UPD70208HGF-16-3B9.pdf
(110 pages)
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Part Number:
UPD70208HGF-16-3B9
Manufacturer:
NEC
Quantity:
20 000
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104
Infrared reflow
VPS
Wave soldering
Partial pin heating
Soldering Method
Caution Do not use one soldering method in combination with another. (however, partial pin heating can
(c) L, F masks
be performed with other soldering methods).
Package peak temperature: 235 C, Time: 30 sec. max. (210 ˚C min.),
Number of times: 3 max.
Package peak temperature: 215 C, Time: 40 sec. (200 C min.)
Number of times: 3 max.
Solder bath temperature: 260 C max., Time: 10 sec. max.,
Number of times: 1, Preheating temperature: 120 C max. (Package surface
temperature)
Pin temperature: 300 C max., Time: 3 sec. max. (per device side)
Data Sheet U13225EJ4V0DS00
Soldering Conditions
PD70208H, 70216H
Conditions Symbol
Recommended
WS60-00-1
VP15-00-3
IR35-00-3
—
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