SC16C652BIBS PHILIPS [NXP Semiconductors], SC16C652BIBS Datasheet - Page 42

• Manufacturer Part Number: SC16C652BIBS
• Description: 5V, 3.3 V and 2.5V dual UART, 5 Mbit/s (max.),with 32-byte FIFOs and infrared(IrDA) encoder/decoder
• Manufacturer: PHILIPS [NXP Semiconductors]

Philips Semiconductors
13. Revision history
Table 31:
9397 750 14452
Product data
Rev Date
03
02
01
20041210
20040617
20040326
Revision history
CPCN
-
-
-
[3]
[4]
[5]
[6]
[7]
[8]
[9]
Description
Product data (9397 750 14452)
Modifications:
Product data (9397 750 13123). Supersedes data of 20040326 (9397 750 11972).
Product data (9397 750 11972).
•
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217 C
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or
larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than
0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex
foil by using a hot bar soldering process. The appropriate soldering profile can be provided on
request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
There is no modification to the data sheet. However, reader is advised to refer to
AN10333 (Rev. 02) “SC16CXXXB baud rate deviation tolerance” (9397 750 14411)
that was released together with this revision.
Rev. 03 — 10 December 2004
Dual UART with 32-byte FIFOs and IrDA encoder/decoder
10 C measured in the atmosphere of the reflow
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
SC16C652B
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