HLMP-HB61 AVAGO [AVAGO TECHNOLOGIES LIMITED], HLMP-HB61 Datasheet - Page 9

• Manufacturer Part Number: HLMP-HB61
• Description: Precision Optical Performance Red, Green and Blue 5mm Standard Oval LEDs
• Manufacturer: AVAGO [AVAGO TECHNOLOGIES LIMITED]

Precautions
Lead Forming:
• The leads of an LED lamp may be preformed or cut
• If lead forming is required before soldering, care must
• For better control, it is recommended to use proper
Soldering Condition:
• Care must be taken during PCB assembly and solder-
• The closest manual soldering distance of the solder-
• Recommended soldering condition:
• Wave soldering parameter must be set and maintain
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to length prior to insertion and soldering into PC
board.
be taken to avoid any excessive mechanical stress
induced to LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
tool to precisely form and cut the leads to length
rather that doing it manually.
ing process to prevent damage to LED component.
ing heat source (soldering iron’s tip) to the body is
1.59mm. Soldering the LED closer than 1.59mm might
damage the LED.
according to recommended temperature and dwell
time in the solder wave. Customer is advised to daily
check on the soldering profile to ensure the soldering
profile used is always conforming to recommended
soldering condition.
Note:
1. PCB with different size and design (component density) will have
2. Avago Technologies’ high brightness LED are using high effi-
Pre-heat temperature
Preheat time
Peak temperature
Dwell time
different heat mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to re-calibrate the solder-
ing profile again prior to loading a new type of PCB.
ciency LED die with single wire bond as shown below. Customer
is advised to take extra precaution during wave soldering to
ensure that the maximum wave temperature is not exceeding
recommendation of 250 ° C. Over-stressing the LED during sol-
dering process might cause premature failure to the LED due to
delamination.
Wave Soldering
105 °C Max.
30 sec Max
250 °C Max.
3 sec Max.
1.59mm
Manual Solder
Dipping
-
-
260 °C Max.
5 sec Max
Avago Technologies LED configuration
• If necessary, use fixture to hold the LED component
• At elevated temperature, the LED is more susceptible
• Special attention must be given to board fabrication,
• Recommended PC board plated through holes size for
• Over sizing of plated through hole can lead to twisting
or improper LED placement during auto insertion. Un-
der sizing plated through hole can lead to mechanical
stress on the epoxy lens during clinching
Note: Electrical connection between bottom surface of LED die and
the leadframe material through conductive paste or solder.
in proper orientation with respect to the PCB during
soldering process.
Note: In order to further assist customer in designing jig accurately
that fit Avago Technologies’ product, 3D model of the product is
available upon request.
to mechanical stress. Therefore, PCB must be allowed
to cool down to room temperature prior to handling,
which includes removal of jigs, fixtures or pallet.
solder masking, surface plating and lead holes size
and component orientation to assure solderability.
LED component leads.
Note: Refer to application note AN1027 for more information
on soldering LED components.
LED component
Lead size
0.457 x 0.457mm
(0.018 x 0.018inch)
0.508 x 0.508mm
(0.020 x 0.020inch)
AlInGaP Device
Diagonal
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
Plated through
hole diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
1.049 to 1.150mm
(0.041 to 0.045 inch)
InGaN Device