HLMP-HB57 AVAGO [AVAGO TECHNOLOGIES LIMITED], HLMP-HB57 Datasheet
HLMP-HB57
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HLMP-HB57 Summary of contents
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... HLMP-HD55, HLMP-HM57, HLMP-HB57 Precision Optical Performance Red, Green and Blue 5 mm Standard Oval LEDs Data Sheet Description These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and ...
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... Device Selection Guide Part Number Color HLMP-HD55-NR0xx Red HLMP-HB57-KN0xx Blue HLMP-HB57-LMCxx Blue HLMP-HB57-LP0xx Blue HLMP-HM57-SV0xx Green HLMP-HM57-RSCxx Green HLMP-HM57-RU0xx Green Notes: 1. Tolerance for luminous intensity measurement is ±15%. ...
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Part Numbering System Note: Please refer to AB 5337 for complete information about part numbering system. Absolute Maximum Rating Parameters [1] ...
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Electrical/Optical Characteristics ° Parameters Symbol Forward Voltage V F Red Green Blue Reverse Voltage V R Red Green, Blue Capacitance C Red Green Blue [1] Thermal ...
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AlInGaP Red Figure 1. Relative intensity vs. wavelength. Figure 3. Forward current vs. forward voltage. InGaN Blue and Green Figure 5. Relative intensity vs. wavelength 100 – ...
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Figure 8. Relative intensity vs. forward current. 1.0 0 ANGULAR DISPLACEMENT – DEGREES Figure 10. Spatial radiation pattern – major axis. 1.0 0 ANGULAR DISPLACEMENT – DEGREES Figure 11. Spatial ...
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Intensity Bin Limit Table Intensity (mcd Bin Min Max K 310 400 L 400 520 M 520 680 N 680 880 P 880 1150 Q 1150 1500 R 1500 1900 S 1900 2500 T 2500 3200 U ...
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Avago Color Bin on CIE 1931 Diagram 1.000 0.800 Green 5 0.600 Y 0.400 0.200 Blue 0.000 0.000 0.100 0.200 0.300 Relative Light Output vs. Junction Temperature 10 1 0.1 -40 ...
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Precautions: Lead Forming: • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering on PC board. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. • If manual lead cutting is necessary, cut the leads after the soldering process. The solder connection forms a mechanical ground which prevents mechanical stress due to lead cutting from traveling into LED package. This is highly recommended for hand solder operation, as the excess lead length also acts as small heat sink. Soldering and Handling: ...
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Refer to application note AN5334 for more information about soldering and handling of high brightness TH LED lamps. Example of Wave Soldering Temperature Profile for TH LED TURBULENT WAVE 250 200 150 100 50 PREHEAT Ammo Packs Drawing 6.35 ± 1.30 (0.25 ± 0.0512) 9.125 ± 0.625 (0.3593 ± 0.0246) 18.00 ± 0.50 ...
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Packaging Box for Ammo Packs FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARD. ANODE LEAD LEAVES THE BOX FIRST. Note: For InGaN device, the ammo pack packaging box contains ESD logo. Packaging Label (i) Avago Mother Label: (Available on packaging box of ammo pack and shipping box) (1P) Item: Part Number (1T) Lot: Lot Number LPN (9D) MFG Date: ...
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PART #: Part Number LOT#: Lot Number MFG DATE: Manufacturing Date C/O: Country of Origin Customer P/N: Supplier Code: Acronyms and Definition: BIN: (i) Color bin only or VF bin only (Applicable for part number with color bins but without VF bin OR part number with VF bins and no color bin) OR (ii) Color bin incorporated with VF Bin (Applicable for part number that have both color ...