HLMP-CYXX AVAGO [AVAGO TECHNOLOGIES LIMITED], HLMP-CYXX Datasheet
HLMP-CYXX
Related parts for HLMP-CYXX
HLMP-CYXX Summary of contents
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... HLMP-CYxx Precision Optical Performance 5mm Round Warm White LED Lamps Data Sheet Description These high intensity white LED lamps are based on InGaN material technology. A blue LED die is coated by phosphor to produce white. The typical resulting color is described by the coordi- nates x= 0.41 0.39 using the CIE 1931 Chromaticity Diagram. These T-1¾ ...
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... HLMP-CY46/47 Package drawing Package Dimension C 5.00 ± 0.20 (0.197 ± 0.008) 1.14 ± 0.20 8.71 ± 0.20 (0.045 ± 0.008) (0.343 ± 0.008) 2.35 (0.093) MAX. 0.70 (0.028) MAX. 31.60 MIN. (1.244) CATHODE LEAD 0.50 ± 0.10 SQ. TYP. 1.00 MIN. (0.020 ± 0.004) (0.039) 5.80 ± 0.20 (0.228 ± 0.008) CATHODE FLAT 2.54 ± 0.38 (0.100 ± 0.015) Note: 1 ...
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... Part Numbering System HLMP - Packaging Option DD: Ammopacks Color Bin Selection 0: Open distribution Maximum Intensity Bin 0: No maximum intensity limit Minimum Intensity Bin Refer to Device Selection Guide Viewing Angle 11/12: 15° package 26/27: 23° package 36/37: 30° package 46/47: 50° package Color: Y: Warm White ...
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WAVELENGTH - nm Figure 1. Relative Intensity vs. Wavelength 1.6 1.4 1.2 1 0.8 0.6 0.4 0 FORWARD CURRENT - mA Figure 3. Relative ...
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... Figure 6. Radiation pattern for HLMP-CY11/12 1 0.8 0.6 0.4 0 ANGULAR DISPLACEMENT - DEGREES Figure 8. Radiation pattern for HLMP-CY36/ 0.8 0.6 0.4 0 -90 Figure 7. Radiation pattern for HLMP-CY26/27 1 0.8 0.6 0.4 0.2 0 120 150 180 0 Figure 9. Radiation pattern for HLMP-CY46/47 -60 - ANGULAR DISPLACEMENT - DEGREES 120 150 ANGULAR DISPLACEMENT - DEGREES 90 180 ...
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Intensity Bin Limit Table at 20mA Intensity (mcd Bin Min T 500 U 300 V 400 W 5500 X 700 Y 9300 Z 000 Tolerance for each bin limit is ± 15% Avago Warm white binning on CIE 1931 Chromaticity Diagram 0.500 0.450 0.400 ...
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Precautions: Lead Forming: • The leads of an LED lamp may be performed or cut to length prior to insertion and soldering on PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress that induced into the LED package. Otherwise, cut the leads to applicable length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress, due to the lead cutting, from traveling to the LED chip die attach and wirebond. • For better control, ...
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Recommended Wave Soldering Profile TURBULENT WAVE 250 200 150 FLUXING 100 50 30 PREHEAT Ammo Packs Drawing 6.35±1.30 0.50±0.0394 0.25±0.0512 9.125±0.625 0.3593±0.0246 18.00±0.50 0.7087±0.0197 12.70±0.30 0.50±0.0118 Note: The ammo-packs drawing is applicable for packaging option –DD & -ZZ and regardless standoff or non-standoff 8 LAMINAR WAVE HOT AIR KNIFE TIME - SECONDS 12.70±1.00 ...
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Packaging Box for Ammo Packs Note: For InGaN device, the ammo pack packaging box contain ESD logo For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies, Limited in the United States and other ...