HLMP-CYXX AVAGO [AVAGO TECHNOLOGIES LIMITED], HLMP-CYXX Datasheet - Page 7

• Manufacturer Part Number: HLMP-CYXX
• Description: Precision Optical Performance 5mm Round Warm White LED Lamps
• Manufacturer: AVAGO [AVAGO TECHNOLOGIES LIMITED]

7
Precautions:
Lead Forming:
• The leads of an LED lamp may be performed or cut to
• If lead forming is required before soldering, care must
• For better control, it is recommended to use proper
Soldering condition:
• Care must be taken during PCB assembly and
• The closest manual soldering distance of the soldering
• Recommended soldering condition:
• Wave soldering parameter must be set and maintain
length prior to insertion and soldering on PC board.
be taken to avoid any excessive mechanical stress that
induced into the LED package. Otherwise, cut the
leads to applicable length after soldering process at
room temperature. The solder joint formed will absorb
the mechanical stress, due to the lead cutting, from
traveling to the LED chip die attach and wirebond.
tool to precisely form and cut the leads to applicable
length rather than doing it manually.
soldering process to prevent damage to the LED
component.
heat source (soldering iron’s tip) to the body is
1.59mm. Soldering the LED closer than 1.59mm might
damage the LED.
according to the recommended temperature and
dwell time. Customer is advised to daily check on the
soldering profile to ensure that the soldering profile
is always conforming to recommended soldering
condition.
Note:
1. PCB with different size and design (component density) will
2. Avago Technologies’ high brightness LED are using high
Pre-heat temperature
Preheat time
Peak temperature
Dwell time
have different heat mass (heat capacity). This might cause a
change in temperature experienced by the board if same wave
soldering setting is used. So, it is recommended to re-calibrate
the soldering profile again before loading a new type of PCB.
efficiency LED die with single wire bond as shown below.
Customer is advised to take extra precaution during wave
soldering to ensure that the maximum wave temperature is
not exceeding 250°C. Over-stressing the LED during soldering
process might cause premature failure to the LED due to
delamination.
Wave Soldering
05 °C Max.
30 sec Max
50 °C Max.
3 sec Max.
1.59mm
Manual Solder
Dipping
-
-
60 °C Max.
5 sec Max
Avago Technologies LED configuration
• If necessary, use fixture to hold the LED component
• At elevated temperature, the LED is more susceptible
• Special attention must be given to board fabrication,
• Recommended PC board plated through holes size for
• Under sizing of plated through hole can lead to
Note: Electrical connection between bottom surface of LED die and
the lead frame material through conductive paste of solder.
in proper orientation with respect to the PCB during
soldering process.
to mechanical stress. Therefore, PCB must allowed to
cool down to room temperature prior to handling,
which includes removal of jigs, fixtures or pallet.
solder masking, surface platting and lead holes size
and component orientation to assure the solderability.
LED component leads.
twisting or improper LED placement during auto
insertion. Over sizing plated through hole can lead to
mechanical stress on the epoxy lens during clinching.
Note: Refer to application note AN1027 for more information on
soldering LED components.
LED component
lead size
0.457 x 0.457 mm
(0.08 x 0.08 inch)
0.508 x 0.508 mm
(0.00 x 0.00 inch)
Anode
InGaN Device
Diagonal
0.646 mm
(0.05 inch)
0.78 mm
(0.08 inch)
Plated through
hole diameter
0.976 to .078 mm
(0.038 to 0.04 inch)
.049 to .50 mm
(0.04 to 0.045 inch)