HLMP-CW15 AVAGO [AVAGO TECHNOLOGIES LIMITED], HLMP-CW15 Datasheet - Page 9

• Manufacturer Part Number: HLMP-CW15
• Description: T-13/4 Precision Optical Performance White LED Lamps
• Manufacturer: AVAGO [AVAGO TECHNOLOGIES LIMITED]

9
Precautions:
Lead Forming
• The leads of an LED lamp may be preformed or cut to
• If lead forming is required before soldering, care must
• For better control, it is recommended to use proper tool
Soldering Conditions
• Care must be taken during PCB assembly and soldering
• The closest manual soldering distance of the soldering
• Recommended soldering conditions:
• Wave soldering parameter must be set and maintained
Notes:
1. PCB with different size and design (component density) will have
length prior to insertion and soldering into PC board.
be taken to avoid any excessive mechanical stress
induced into the LED package. Otherwise, cut the leads
of LED to length after soldering process at room
temperature. The solder joint formed will absorb the
mechanical stress of the lead cutting from traveling to
the LED chip die attach and wirebond.
to precisely form and cut the leads to applicable length
rather than doing it manually.
process to prevent damage to the LED component.
heat source (soldering iron’s tip) to the body is 1.59 mm.
Soldering the LED closer than 1.59 mm might damage the
LED.
Pre-heat Temperature 105 C Max.
Pre-heat Time
Peak Temperature
Dwell Time
according to recommended temperature and dwell
time in the solder wave. Customer is advised to daily
check on the soldering profile to ensure that the soldering
profile is always conforming to recommended soldering
condition.
different head mass (heat capacity). This might cause a change in
temperature experienced by the board if same wave soldering
setting is used. So, it is recommended to recalibrate the soldering
profile again before loading a new type of PCB.
Wave Soldering Dipping
30 sec Max.
250 C Max.
3 sec Max.
1.59 mm
Manual Solder
–
–
260 C Max.
5 sec Max.
• Over sizing of plated through hole can lead to twisting or
Avago Technologies LED Configuration
• If necessary, use fixture to hold the LED component in
• At elevated temperature, the LED is more susceptible
• Special attention must be given to board fabrication,
• Recommended PC board plated through hole sizes for
2. Avago Technologies' high brightness LED are using high efficiency
Note: Electrical connection between bottom surface of LED die and
the lead frame material through conductive paste of solder.
proper orientation with respect to the PCB during
soldering process.
to mechanical stress. Therefore, PCB must be allowed
to cool down to room temperature prior to handling,
which includes removal of jigs, fixtures or pallet.
solder masking, surface plating and lead holes size and
component orientation to assure solderability.
LED component leads:
improper LED placement during auto insertion. Under
sizing plated through hole can lead to mechanical stress
on the epoxy lens during clinching.
Note: Refer to Application Note AN1027 for more information on
soldering LED components.
LED Component
Lead Size
0.457 x 0.457 mm
(0.018 x 0.018 inch)
0.508 x 0.508 mm
(0.020 x 0.020 inch)
LED die with single wire bond as shown below. Customer is
advised to take extra precaution during wave soldering to ensure
that the maximum wave temperature is not exceeding 250 C.
Overstressing the LED during soldering process might cause
premature failure to the LED due to delamination.
CATHODE
InGaN Device
Diagonal
0.646 mm
(0.025 inch)
0.718 mm
(0.028 inch)
Plated Through
Hole Diameter
0.976 to 1.078 mm
(0.038 to 0.042 inch)
1.049 to 1.150 mm
(0.041 to 0.045 inch)