ASM2I99456G-32-ER PULSECORE [PulseCore Semiconductor], ASM2I99456G-32-ER Datasheet - Page 10

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ASM2I99456G-32-ER

Manufacturer Part Number
ASM2I99456G-32-ER
Description
3.3V/2.5V LVCMOS Clock Fanout Buffer
Manufacturer
PULSECORE [PulseCore Semiconductor]
Datasheet
November 2006
rev 0.3
T
system requirements and Table 11. R
from Table 12. The R
boards, using 2S2P boards will result in a lower thermal
impedance than indicated below.
Table 12. Thermal package impedance of the
32LQFP
J
,MAX should be selected according to the MTBF
Convection,
100 lfpm
200 lfpm
300 lfpm
400 lfpm
500 lfpm
Still air
LFPM
board), °C/W
R
thja
thja
represent data based on 1S2P
86
76
71
68
66
60
(1P2S
Notice: The information in this document is subject to change without notice.
3.3V/2.5V LVCMOS Clock Fanout Buffer
thja
board), °C/W
R
can be derived
thja
61
56
54
53
52
49
(2P2S
If the calculated maximum frequency is below 350 MHz, it
becomes the upper clock speed limit for the given
application conditions. The following eight derating charts
describe the safe frequency operation range for the
ASM2I99456. The charts were calculated for a maximum
tolerable die junction temperature of 110°C (120°C),
corresponding to an estimated MTBF of 9.1 years
transmission line or capacitive loading. Depending on a
given set of these operating conditions and the available
device convection a decision on the maximum operating
frequency can be made.
(4 years), a supply voltage of 3.3V and series terminated
ASM2I99456
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