VND5050J-E_07 STMICROELECTRONICS [STMicroelectronics], VND5050J-E_07 Datasheet - Page 24

• Manufacturer Part Number: VND5050J-E_07
• Description: Double channel high side driver for automotive applications
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

Package and PCB thermal data
4
4.1
Note:
24/37
Package and PCB thermal data
PowerSSO-12™ thermal data
Figure 30. PowerSSO-12™ PC board
Layout condition of R
area= 77mm x 86mm,PCB thickness=1.6mm, Cu thickness=70µm (front and back side),
Copper areas: from minimum pad lay-out to 8cm
Figure 31. R
RTHj_amb(°C/W)
70
65
60
55
50
45
40
35
30
0
ON)
thj-amb
th
Vs. PCB copper area in open box free air condition (one channel
and Z
2
th
measurements (PCB: Double layer, Thermal Vias, FR4
PCB Cu heatsink area (cm^2)
4
2
).
6
VND5050J-E / VND5050K-E
8
10