k9f6408q0c Samsung Semiconductor, Inc., k9f6408q0c Datasheet

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k9f6408q0c

Manufacturer Part Number
k9f6408q0c
Description
8m X 8 Bit Bit Nand Flash Memory
Manufacturer
Samsung Semiconductor, Inc.
Datasheet
Note : For more detailed features and specifications including FAQ, please refer to Samsung’s Flash web site.
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have any questions, please contact the
SAMSUNG branch office near you.
K9F6408Q0C
K9F6408U0C
Document Title
Revision History
The attached datasheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
Revision No.
8M x 8 Bit NAND Flash Memory
http://www.samsung.com/Products/Semiconductor/Flash/TechnicalInfo/datasheets.htm
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History
Initial issue.
1. I
-min. Value: 7mA -->3mA
-typ. Value: 8mA -->4mA
2. Package part number is modified.
3. AC parameter is changed.
1. TBGA package is changed.
2. Part number(TBGA package part number) is changed
3. K9F6408U0C-BCB0,BIB0 products are added
1. WSOP1 package is added.
1. Add the Rp vs tr ,tf & Rp vs ibusy graph for 1.8V device (Page 28)
2. Add the data protection Vcc guidence for 1.8V device - below about
1.1V. (Page 29)
The min. Vcc value 1.8V devices is changed.
K9F64XXQ0C : Vcc 1.65V~1.95V --> 1.70V~1.95V
Pb-free Package is added.
K9F6408U0C-QCB0,QIB0
K9F6408U0C-HCB0,HIB0
K9F6408Q0C-HCB0,HIB0
K9F6408U0C-FCB0,FIB0
Note is added.
(VIL can undershoot to -0.4V and VIH can overshoot to VCC +0.4V for
durations of 20 ns or less.)
1. Add the Protrusion/Burr value in WSOP1 PKG Diagram.
1. PKG(WSOP1) Dimension Change
- 9mmX11mm 63ball TBGA ---> 6mmX8.5mm 48ball TBGA
- K9F6408Q0C-D ----> K9F6408Q0C-B
- K9F6408U0C-D -----> K9F6408U0C-B
K9F6408U0C-Y ---> K9F6408U0C_T
tRP(min.) : 30ns --> 25ns
- Part number : K9F6408U0C_VCB0,VIBO
OL
(R/B) of 1.8V device is changed.
1
Draft Date
Jul. 24 . 2001
Nov. 5 . 2001
Nov. 12 . 2001
Mar. 13 . 2002
Nov. 21. 2002
Mar. 05. 2003
Mar. 13 . 2003
Jul. 04. 2003
Apr. 24. 2004
May. 24. 2004
FLASH MEMORY
Remark
Advance
Preliminary

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k9f6408q0c Summary of contents

Page 1

... AC parameter is changed. tRP(min.) : 30ns --> 25ns 0.2 1. TBGA package is changed. - 9mmX11mm 63ball TBGA ---> 6mmX8.5mm 48ball TBGA 2. Part number(TBGA package part number) is changed - K9F6408Q0C-D ----> K9F6408Q0C-B - K9F6408U0C-D -----> K9F6408U0C-B 3. K9F6408U0C-BCB0,BIB0 products are added 1. WSOP1 package is added. 0.3 - Part number : K9F6408U0C_VCB0,VIBO 1. Add the ,tf & ibusy graph for 1.8V device (Page 28) ...

Page 2

... Serial Page Access - 1.8V device(K9F6408Q0C) : 50ns - 3.3V device(K9F6408U0C) : 50ns Fast Write Cycle Time - Program Time - 1.8V device(K9F6408Q0C) : 200 s(Typ.) - 3.3V device(K9F6408U0C) : 200 s(Typ.) - Block Erase Time : 2ms(Typ.) GENERAL DESCRIPTION The K9F6408X0C is a 8M(8,388,608)x8bit NAND Flash Memory with a spare 256K(262,144)x8bit. The device is offered in 1.8V or 3.3V Vcc. Its NAND cell provides the most cost-effective solution for the solid state mass storage market. A program operation pro- grams the 528-byte page in typical 200 s and an erase operation can be performed in typical 2ms on an 8K-byte block ...

Page 3

... K9F6408Q0C K9F6408U0C PIN CONFIGURATION (TSOP II ) K9F6408U0C-TCB0,QCB0/TIB0,QIB0 V SS CLE ALE WE WP N.C N.C N.C N.C N.C N.C N.C N.C N.C N.C I/O0 I/O1 I/O2 I/ PACKAGE DIMENSIONS 44(40) LEAD/LEAD FREE PLASTIC THIN SMALL OUT-LINE PACKAGE TYPE(II) 44(40) - TSOP II - 400F #44(40) #1 18.81 Max. 0.741 18.41 0.10 0.725 0.004 0.805 0.35 0.10 0.032 0.014 0.004 R GND ...

Page 4

... K9F6408Q0C K9F6408U0C PIN CONFIGURATION (TBGA) K9F6408X0C-BCB0,HCB0/BIB0,HIB0 N.C B N.C C N.C D N.C E N PACKAGE DIMENSIONS 48-Ball TBGA (measured in millimeters) Top View 6.00 0.10 Ball # N.C ALE CE WE R/B RE CLE N.C N.C N.C N.C N.C N.C N.C N.C N.C N.C N.C N.C N.C N.C N.C N.C N.C N.C I/O N.C N.C N I/O I/O N.C I/O CCQ I/O I/O I/O I (Top View) Bottom View 6.00 0.80 x5= 4.00 0.80 (Datum ...

Page 5

... K9F6408Q0C K9F6408U0C PIN CONFIGURATION (WSOP1) K9F6408U0C-VCB0,FCB0/VIB0,FIB0 N.C 1 N.C 2 DNU 3 N.C 4 N.C 5 N DNU 10 N.C 11 Vcc 12 Vss 13 N.C 14 DNU 15 CLE 16 ALE N.C 20 N.C 21 DNU 22 N.C 23 N.C 24 PACKAGE DIMENSIONS 48-PIN LEAD PLASTIC VERY VERY THIN SMALL OUT-LINE PACKAGE TYPE ( WSOP1 - 1217F #1 #24 ...

Page 6

... K9F6408Q0C K9F6408U0C PIN DESCRIPTION Pin Name DATA INPUTS/OUTPUTS I/O ~ I/O The I/O pins are used to input command, address and data, and to output data during read operations. The pins float to high-z when the chip is deselected or when the outputs are disabled. COMMAND LATCH ENABLE CLE The CLE input controls the activating path for commands sent to the command register ...

Page 7

... K9F6408Q0C K9F6408U0C Figure 1. FUNCTIONAL BLOCK DIAGRAM X-Buffers Latches & Decoders Y-Buffers Latches & Decoders Command Command CE Control Logic RE & High Voltage WE Generator CLE Figure 2. ARRAY ORGANIZATION 16K Pages 1st half Page Register (=1,024 Blocks) (=256 Bytes) ...

Page 8

... K9F6408Q0C K9F6408U0C PRODUCT INTRODUCTION The K9F6408X0C is a 66Mbit(69,206,016 bit) memory organized as 16,384 rows(pages) by 528 columns. Spare sixteen columns are located from column address of 512 to 527. A 528-byte data register is connected to memory cell arrays accommodating data trans- fer between the I/O buffers and memory during page read and page program operations. The memory array is made cells that are serially connected to form a NAND structure ...

Page 9

... Vcc(max Vcc(max) - OUT I/O pins Vcc -0.4 Q Except I/O pins V -0 -0.3 K9F6408Q0C :I =-100 A OH Vcc -0.1 Q K9F6408U0C :I =-400 A OH K9F6408Q0C :I =100uA OL - K9F6408U0C :I =2.1mA OL K9F6408Q0C :V =0. K9F6408U0C :V =0.4V OL +0.4V for durations less FLASH MEMORY Rating Unit K9F6408U0C(3.3V) -0 4 4 4 125 ...

Page 10

... The 1st block, which is placed on 00h block address, is guaranteed valid block, does not require Error Correction program/erase cycles. AC TEST CONDITION (K9F6408X0C-XCB0:TA K9F6408X0C-XIB0:TA=- K9F6408Q0C: Vcc=1.70V~1.95V , K9F6408U0C: Vcc=2.7V~3.6V unless otherwise noted) Parameter Input Pulse Levels Input Rise and Fall Times ...

Page 11

... The time to Ready depends on the value of the pull-up resistor tied R/B pin. K9F6408Q0C K9F6408U0C Min Max Min ( K9F6408Q0C Symbol Min Max AR1 AR2 CLR 100 CEA t ...

Page 12

... K9F6408Q0C K9F6408U0C NAND Flash Technical Notes Invalid Block(s) Invalid blocks are defined as blocks that contain one or more invalid bits whose reliability is not guaranteed by Samsung. The informa- tion regarding the invalid block( called as the invalid block information. Devices with invalid block(s) have the same quality level or as devices with all valid blocks and have the same AC and DC characteristics ...

Page 13

... K9F6408Q0C K9F6408U0C NAND Flash Technical Notes Error in write or read operation Within its life time, the additional invalid blocks may develop with NAND Flash memory. Refer to the qualification report for the actual data.The following possible failure modes should be considered to implement a highly reliable system. In the case of status read fail- ure after erase or program, block replacement should be done ...

Page 14

... K9F6408Q0C K9F6408U0C NAND Flash Technical Notes Erase Flow Chart Start Write 60h Write Block Address Write D0h Read Status Register I R Yes * No Erase Error I Yes Erase Completed : If erase operation results in an error, map out * the failing block and replace it with another block. ...

Page 15

... K9F6408Q0C K9F6408U0C Pointer Operation of K9F6408U0C Samsung NAND Flash has three address pointer commands as a substitute for the two most significant column addresses. ’00h’ command sets the pointer to ’A’ area(0~255byte), ’01h’ command sets the pointer to ’B’ area(256~511byte), and ’50h’ command sets the pointer to ’ ...

Page 16

... K9F6408Q0C K9F6408U0C System Interface Using CE don’t-care. For an easier system interface, CE may be inactive during the data-loading or sequential data-reading as shown below. The internal 528byte page registers are utilized as seperate buffers for this operation and the system design gets more flexible. In addition, for voice or audio applications which use slow cycle time on the order of u-seconds, de-activating CE during the data-loading and read- ing would provide significant savings in power consumption ...

Page 17

... K9F6408Q0C K9F6408U0C Command Latch Cycle CLE CE WE ALE I Address Latch Cycle t CLS CLE ALE I CLH CLS ALH ALS Command ALH ALS t ALS ...

Page 18

... K9F6408Q0C K9F6408U0C Input Data Latch Cycle CLE CE t ALS ALE I/O ~ DIN Serial access Cycle after Read R/B NOTES : Transition is measured 200mV from steady state voltage with load. This parameter is sampled and not 100% tested ...

Page 19

... K9F6408Q0C K9F6408U0C Status Read Cycle CLE I READ1 OPERATION (READ ONE PAGE) CLE ALE RE 00h or 01h I Column Page(Row) Address Address R/B t CLR CLS t CLH WHR 70h On K9F6408U0C_T,Q or K9F6408U0C_V,F ...

Page 20

... K9F6408Q0C K9F6408U0C READ1 OPERATION (INTERCEPTED BY CE) CLE CE WE ALE RE A 00h or 01h I Column Address R/B READ2 OPERATION (READ ONE PAGE) CLE CE WE ALE RE I/O ~ 50h R/B M Address K9F6408U0C_T,Q or K9F6408U0C_V,F CE must be held low during AR2 ...

Page 21

... K9F6408Q0C K9F6408U0C SEQUENTIAL ROW READ OPERATION (only for K9F6408U0C-T,Q and K9F6408U0C-V,F valid within a block) CLE CE WE ALE RE 00h I R/B M PAGE PROGRAM OPERATION CLE ALE RE 80h I Sequential Data Column Page(Row) Input Command ...

Page 22

... Read ID Command (ERASE ONE BLOCK BERS DOh 22 Busy Erase Command t CLR t AR1 t REA 00h Maker Code Device K9F6408Q0C K9F6408U0C 22 FLASH MEMORY 70h I/O 0 I/O =0 Successful Erase 0 Read Status I/O =1 Error in Erase 0 Command Device ECh Code* Device Code Device Code* 39h E6h ...

Page 23

... K9F6408Q0C K9F6408U0C DEVICE OPERATION PAGE READ Upon initial device power up, the device defaults to Read1 mode. This operation is also initiated by writing 00h to the command regis- ter along with three address cycles. Once the command is latched, it does not need to be written for the following page read opera- tion ...

Page 24

... K9F6408Q0C K9F6408U0C Figure 4. Read2 Operation CLE CE WE ALE R/B RE Start Add.(3Cycle) 50h I & Don't Care) Figure 5. Sequential Row Read1 Operation (only for K9F6408U0C-T,Q and K9F6408U0C-V,F valid within a block) R/B I/O ~ Start Add.(3Cycle 00h 01h & A ...

Page 25

... K9F6408Q0C K9F6408U0C Figure 6. Sequential Row Read2 Operation (GND Input=Fixed Low) (only for K9F6408U0C-T,Q and K9F6408U0C-V,F valid within a block) R/B 50h Start Add.(3Cycle) I & Don t Care) PAGE PROGRAM The device is programmed basically on a page basis, but it does allow multiple partial page programming of a byte or consecutive bytes up to 528 single page program cycle ...

Page 26

... K9F6408Q0C K9F6408U0C BLOCK ERASE The Erase operation is done on a block(8K Byte) basis. Block address loading is accomplished in two cycles initiated by an Erase Setup command(60h). Only address A 13 block address loading initiates the internal erasing process. This two-step sequence of setup followed by execution command ensures that memory contents are not accidentally erased due to external noise conditions ...

Page 27

... FFh Table3. Device Status Operation Mode t CLR t CEA t AR1 tREA 00h ECh Maker code Device K9F6408Q0C K9F6408U0C after the Reset command is written. Reset command is RST t RST After Power-up Read 1 27 FLASH MEMORY Device Code* Device code Device Code* 39h E6h ...

Page 28

... K9F6408Q0C K9F6408U0C READY/BUSY The device has a R/B output that provides a hardware method of indicating the completion of a page program, erase and random read completion. The R/B pin is normally high but transitions to low after program or erase command is written to the command regis- ter or random read is started after address loading. It returns to high when the internal controller has finished the operation. The pin is an open-drain driver thereby allowing two or more R/B outputs to be Or-tied ...

Page 29

... Data Protection & Powerup sequence The device is designed to offer protection from any involuntary program/erase during power-transitions. An internal voltage detector disables all functions whenever Vcc is below about 1.1V/2V(K9F6408Q0C:1.1V, K9F6408U0C:2V). WP pin provides hardware pro- tection and is recommended to be kept at V before internal circuit gets ready for any command sequences as shown in Figure 12. The two step command sequence for program/ erase provides additional software protection ...

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