acpm-5007 Avago Technologies, acpm-5007 Datasheet - Page 6

• Manufacturer Part Number: acpm-5007
• Description: Lte Band7 2500-2570 Mhz 3 X 3 Mm Power Amplii Er Module
• Manufacturer: Avago Technologies

Metallization
Solder Mask Opening
Solder Paste Stencil Aperture
6
0.35
0.45
0.60
0.35
0.60
0.60
0.30
0.65
0.55
0.55
1.50
1.10
on 0.5 mm pitch
Ø 0.3 mm
connected to a inner layer
through a via hole for a
better isolation between
CPL_IN(ISO) and RFout
0.45
0.50
0.45
0.475
0.475
1.30
0.525
1.10
PCB Design Guidelines
The recommended PCB land pattern is shown in fi gures
on the left side. The substrate is coated with solder mask
between the I/O and conductive paddle to protect the
gold pads from short circuit that is caused by solder
bleeding/bridging.
Stencil Design Guidelines
A properly designed solder screen or stencil is required
to ensure optimum amount of solder paste is deposited
onto the PCB pads.
The recommended stencil layout is shown here. Reducing
the stencil opening can potentially generate more voids.
On the other hand, stencil openings larger than 100% will
lead to excessive solder paste smear or bridging across the
I/O pads or conductive paddle to adjacent I/O pads. Con-
sidering the fact that solder paste thickness will directly
aff ect the quality of the solder joint, a good choice is to
use laser cut stencil composed of 0.100 mm(4 mils) or
0.127 mm(5 mils) thick stainless steel which is capable of
producing the required fi ne stencil outline.