acpm-7886 Avago Technologies, acpm-7886 Datasheet

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acpm-7886

Manufacturer Part Number
acpm-7886
Description
Td-scdma Power Amplifier
Manufacturer
Avago Technologies
Datasheet

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Part Number:
acpm-7886-TR1
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AVAGO
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17 090
Part Number:
acpm-7886-TR1
Manufacturer:
AVAGO/安华高
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ACPM-7886
TD-SCDMA Power Amplifier
Data Sheet
General Description
The ACPM-7886 is an amplifier module designed for
TD-SCDMA applications in the 2010-2025MHz band.
Designed around Avago Technologies’ GaAs
Enhancement Mode pHEMT process, the ACPM-7886
offers premium performance in a very small form factor.
It is matched to 50 Ohms on the input and output.
The amplifier has excellent ACLR and efficiency
performance at max Pout and low quiescent current
(50mA) with a single bias control voltage, Vctrl = 2.0V.
Designed in a surface mount RF package, the ACPM-
7886 is very cost and size competitive.
Functional Block Diagram
RF in
(2)
Vdd1
(1)
Vctrl
(4)
Bias Control
Vdd2
(5)
Vdd3
(10)
MMIC
(3,6,7,9)
Gnd
Module
Output
Match
RF out
(8)
Features
• Operating frequency: 2010 - 2025 MHz
• 28 dBm Linear Output Power @ 3.5V
• High Efficiency 41% PAE
• Single bias, low quiescent current (50mA)
• Internal 50 ohm matching networks for both RF
• 3.2 - 4.2 V linear operation
• 4.0 x 4.0mm SMT Package
• Low package profile, 1.1mm
Applications
• TD-SCDMA Handsets
• TD-SCDMA Data Cards
• TD-SCDMA PDAs
input & output

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acpm-7886 Summary of contents

Page 1

... ACPM-7886 TD-SCDMA Power Amplifier Data Sheet General Description The ACPM-7886 is an amplifier module designed for TD-SCDMA applications in the 2010-2025MHz band. Designed around Avago Technologies’ GaAs Enhancement Mode pHEMT process, the ACPM-7886 offers premium performance in a very small form factor matched to 50 Ohms on the input and output. ...

Page 2

... Package Diagram AVAGO ACPM-7886 MLYWWDD XXXX 4mm sq Pin Description Table Pin Number Pin Label Description 1 Vdd1 Supply bias 2 RFin RF input 3 N/C No internal connection 4 Vctrl Control voltage 5 Vdd2 Supply bias 6 Gnd Ground 7 Gnd Ground 8 RFout RF output 9 Gnd Ground 10 Vdd3 Supply bias 2 Vdd3 (Pin 10) ...

Page 3

... Min -30 °C Min. Typ. 1.0 V 3.5 V 2.6 V 2.85 V 1.9 V 2.0 V -20 °C Marking Notes : Row Manufacturing Location Y = Year WW = Work Week DD = Date Code Row 4: XXXX = Trace Code (Avago Technologies internal reference) Max. 5.0 V 5 dBm +90 °C 12:1 +100 °C Max. 4.5 V 4.5 V 2.1 V +85 °C ...

Page 4

Electrical Characteristics of TD-SCDMA PA Unless Otherwise Specified: f=2010-2025MHz, Vdd1=Vdd3=3.5V, Vdd2=2.85V, Vctrl=2.0V, Pout=28.0dBm, Ta=25°C, Zin/Zout = 50Ω Parameter Leakage Current, Idd1,2,3; Vctrl Off Control Current, Ictrl; Vctrl=2.0 V Bias Current, Idd2; Vctrl=2 V, Vdd2=2.85 V Quiescent Current, Idd1,3; ...

Page 5

Figure 1. Transmit off power. Signal Studio Configuration Figure 2 TD-SCDMA signal configuration. 5 Transmitter Off Power Dynamic Range: 107dB Transmitt Off Power: -83dBm ...

Page 6

... Moisture Sensitivity Classification: Class 3 Preconditioning per JESD22-A113-D Class 3 was performed on all devices prior to reliability testing. ACPM-7886 is a moisture sensitive component. It’s important that the parts are handled under precaution and a proper manner. The handling, baking and out- of-pack storage conditions of the moisture sensitive components are described in IPC/JEDC S-STD-033A ...

Page 7

... Slot for carrier tape insertion for attachment to reel hub (2 places 180 apart) FRONT VIEW 1.5 min. 13.0 0.2 21.0 0.8 Order Information Part Number No. of Devices ACPM-7886-BLK 100 ACPM-7886-TR1 1000 7 18.4 max. +0.4 178 -0.2 50 min. 12.4 +2.0 REEL USER FEED DIRECTION Notes: 1. Reel shall be labeled with the following information (as a minimum). ...

Page 8

Suggested Board Implementation C1 (4700pF) C2 (4700pF) Notes: 1. All decoupling capacitors should be placed as close to the power module as possible. 2. RFin (Pin 2) has a grounded inductor inside package as a matching element. An external series ...

Page 9

... PCB Design Guidelines The recommended ACPM-7886 PCB land pattern is shown in Figure 3. The substrate is coated with solder mask between the I/O and conductive paddle to protect the gold pads from short circuit that is caused by solder bleeding / bridging ...

Page 10

... Solder Paste Recommendation The ACPM-7886 package is a lead free package that was proven to pass MSL3 when reflowed under lead free solder reflow profile. The recommended lead free solder for SMT reflow is Sn-Ag-Cu (95.5% Tin, 3.8% Silver, 0.7% Copper) or other similar Sn-Ag-Cu solders. This lead free solder paste has a melting point of 218°C (423° ...

Page 11

... TD-SCDMA uses the same control technique except that each frame is 5ms with only 7 timeslots and an additional 75us downlink pilot and a 125us uplink pilot. Each of the 7 slots is 675uS. For the ACPM-7886, the Vctrl pin is used instead of Vapc GSM, there is a time mask specification that must be met, but conformance to this spec is dictated by the Vapc ramp ...

Page 12

... Figure 8. Signal Studio configuration. Technically the mobile will transmit on the uplink, but the main point is to display the configurability for each slot. In fact, the test for ACPM-7886 does not require the full 16 code channels. Signal Studio is most beneficial for a base station uplink or downlink test where multiple users will be transmitting on the same time slot ...

Page 13

... Results ACPM-7886 delivers good performance for TD-SCDMA in the 2010 – 2025MHz frequency band see figures 10, 11, and 12. At Vdd of 3.5V, Vdd2 of 2.85 and Vcntl of 2V and Pout of 28dBm this device produces efficiency of 40% and ACLR1/ACLR2 of 41dBc and 56 dBc respectively. In normal CDMA or WCDMA systems, receiver sensitivity is greatly affected by the TX power leakage, thus the transmit off power is of great importance ...

Page 14

... Chinese TD- SCDMA standard. In addition, ACPM-7886 has a proven track record for great results in the UMTS2100 under WCDMA modulation with or without HSDPA. This makes ACPM-7886 ideal for a dual mode/dual band system for the Chinese market. References [1] TD-SCDMA: The Solution for TDD Band, Di- Giuseppe, Principato, Fodor, Siemens White Paper 2002 [2] 29 Oct ...

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