CY28412OC SPECTRALINEAR [SpectraLinear Inc], CY28412OC Datasheet - Page 8

• Manufacturer Part Number: CY28412OC
• Manufacturer: SPECTRALINEAR [SpectraLinear Inc]

Rev 1.0, November 20, 2006
Calculating Load Capacitors
In addition to the standard external trim capacitors, trace
capacitance and pin capacitance must also be considered to
correctly calculate crystal loading. As mentioned previously,
the capacitance on each side of the crystal is in series with the
crystal. This means the total capacitance on each side of the
crystal must be twice the specified crystal load capacitance
(CL). While the capacitance on each side of the crystal is in
series with the crystal, trim capacitors (Ce1,Ce2) should be
calculated to provide equal capacitive loading on both sides.
As mentioned previously, the capacitance on each side of the
crystal is in series with the crystal. This mean the total capac-
itance on each side of the crystal must be 2 times the specified
load capacitance (CL). While the capacitance on each side of
the crystal is in series with the crystal, trim capacitors
(Ce1,Ce2) should be calculated to provide equal capacitance
loading on both sides.
Use the following formulas to calculate the trim capacitor
values for Ce1 and Ce2.
CL ................................................... Crystal load capacitance
CLe .........................................Actual loading seen by crystal
using standard value trim capacitors
Ce .....................................................External trim capacitors
Cs ............................................. Stray capacitance (terraced)
Ci .......................................................... Internal capacitance
(lead frame, bond wires etc.)
CLe
Total Capacitance (as seen by the crystal)
=
(
Load Capacitance (each side)
Ce1 + Cs1 + Ci1
Ce = 2 * CL – (Cs + Ci)
1
+
1
Ce2 + Cs2 + Ci2
Figure 1. Crystal Capacitive Clarification
1
)
PD (Power-down) Clarification
The VTT_PWRGD# /PD pin is a dual function pin. During initial
power-up, the pin functions as VTT_PWRGD#. Once
VTT_PWRGD# has been sampled low by the clock chip, the
pin assumes PD functionality. The PD pin is an asynchronous
active high input used to shut off all clocks cleanly prior to
shutting off power to the device. This signal is synchronized
internal to the device prior to powering down the clock synthe-
sizer. PD is also an asynchronous input for powering up the
system. When PD is asserted high, all clocks are driven to a
low value and held prior to turning off the VCOs and the crystal
oscillator.
PD (Power-down) – Assertion
When PD is sampled high by two consecutive rising edges of
CPUC, all single-ended outputs will be held low on their next
high to low transition and differential clocks must be held high
or Hi-Z (depending on the state of the control register drive
mode bit) on the next diff clock# high to low transition. When
the SMBus PD drive mode bit corresponding to the differential
(CPU, SRC, and DOT) clock output of interest is programmed
to ‘0’, the clock output must be held with “Diff clock” pin driven
high at 2 x Iref, and “Diff clock#” tristate. If the control register
PD drive mode bit corresponding to the output of interest is
programmed to “1”, then both the “Diff clock” and the “Diff
clock#” are Hi-Z. Note the example below shows CPUT = 133
MHz and PD drive mode = ‘1’ for all differential outputs. This
diagram and description is applicable to valid CPU
frequencies 100,133,166,200,266,333, and 400 MHz. In the
event that PD mode is desired as the initial power-on state, PD
must be asserted high in less than 10
VTT_PWRGD#.
CY28412
s after asserting
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