pe-68531g Pulse Specialty Components, pe-68531g Datasheet - Page 8

• Manufacturer Part Number: pe-68531g
• Description: Pe-6853xg Fastpulse High Speed Transceivers
• Manufacturer: Pulse Specialty Components

EMC Considerations
The FASTPULSE high speed LAN transceiver has been
designed and tested to minimize EMI emissions and maximize its
immunity. Some of the key measures employed on the
transceivers are as follows:
FASTPULSE HIGH SPEED
LAN TRANSCEIVERS
Note:
PE-68532G in standard ATM 155 system @ 3 m, anechoic
chamber. Contact Pulse for further setup details if required.
For More Information :
Information furnished in this data sheet is believed to be accurate. However, no responsibility is assumed by Pulse for its use or for any infringements of patents or other
rights of third parties which may result from its use. Data is subject to change without notice. Companies or products mentioned in this document, other than Pulse, are
trademarks of the respective companies or their products.
Corporate
12220 World Trade Drive
San Diego, CA 92128
Tel:
FAX: [phone]
http://www.pulseeng.com
Quick-Facts: 619 674 9672
Multi-Layer board design, with optimized ground plane
partitioning
Edge-Rate control on transceiver IC outputs and signal
filtering
High-Performance magnetics tuned to transceiver silicon
Galvanic shield formed from RJ-45 shield, body shield and
connected to stake posts for direct chassis ground connection
Onboard termination of unused cable pairs to chassis ground
Extensive on-board decoupling of power signals
Integrated design eliminates board parasitic effects
Printed on recycled paper. ©1999, Pulse Engineering, Inc.
619 674 8100
Typical EMI Field Strength (ATM-155)
70
60
50
40
30
20
10
30
FREQUENCY (MHz)
Europe
1 & 2 Huxley Road
The Surrey Research Park
Guildford, Surrey GU2 5RE
United Kingdom
Tel:
FAX: [phone]
FCC A
FCC B
44 1483 401700
CISPR A
CISPR B
200
8
These built-in measures ease the difficult task normally facing the
designer. Nevertheless, it is still crucial to employ good high
speed PCB design rules in laying out the board, as outlined in the
application section.
Physical shielding is an important factor in further minimizing
emissions. The shielded RJ-45 connector has flared extensions
which are intended to form a galvanic connection to cutout in the
backplate. The backplate is typically connected to chassis ground.
The body shield (G version) is further connected to the RJ-45
shield and the two mechanical stake posts. These should be
soldered directly to the chassis ground. This chassis grounding
scheme will minimize EMI emissions and also provide a direct
discharge path to ground for ESD discharges to the exterior of the
device, in line with IEC801 requirements. As an indication, the
graph below shows typical EMI measurements obtained on a
standard setup. It should be noted that EMC performance is a
system measurement and very implementation specific.
Note:
PE-68537G in standard 100-TX system @ 3 m, anechoic
chamber. Contact Pulse for further setup details if required.
Asia
150 Kampong Ampat
#07-01/02
KA Centre
Singapore 368324
Tel: [phone]
FAX: [phone]
Typical EMI Field Strength (100Base-TX)
70
60
50
40
30
20
10
30
FREQUENCY (MHz)
Distributor
FCC A
FCC B
H309.A (7/96)
CISPR A
CISPR B
200