sii1161 Silicon image, sii1161 Datasheet - Page 44

• Manufacturer Part Number: sii1161
• Description: Panellink Receiver
• Manufacturer: Silicon image

Application-Specific Thermal Calculations
The junction temperature of the silicon is the limiting factor to the performance of this device. Junction
temperature may be calculated as shown in Equation 1, where the input factors are:
T
The temperature rise, from ambient to junction (Figure 31), is a function of the power demanded by the operation
of the device, and the thermal resistance of the device. Power consumption is a function of the pixel frequency.
Thermal resistance is a function of the soldered use of the package’s ePad.
SiI-DS-0096-D
J
must not exceed the limit shown in the Absolute Maximum specifications on page 3
70.00
60.00
50.00
40.00
30.00
20.00
10.00
0.00
T
Θ
V
I
CC
25
A
CC
JA
Ambient temperature.
Figure 31. Temperature Rise with Frequency and ePad
ePad 100% soldered
Power supply current (see page 4).
Power supply voltage (see page 3).
Junction-to-Ambient thermal resistance (see page 3).
Equation 1. Junction Temperature Calculation
40
T
J
RxC Frequency (MHz)
=
T
A
65
+
ePad 20% soldered
θ
40
JA
×
V
CC
×
I
108
CC
ePad unsoldered
135
SiI 1161 PanelLink Receiver
165
Data Sheet