BZT52H-B10 NXP [NXP Semiconductors], BZT52H-B10 Datasheet - Page 3

• Manufacturer Part Number: BZT52H-B10
• Description: Single Zener diodes in a SOD123F package
• Manufacturer: NXP [NXP Semiconductors]

NXP Semiconductors
5. Limiting values
6. Thermal characteristics
BZT52H_SER
Product data sheet
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
Table 6.
[1]
[2]
[3]
Symbol
I
I
P
P
T
T
T
Symbol
R
R
F
ZSM
j
amb
stg
ZSM
tot
th(j-a)
th(j-sp)
t
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
Soldering point of cathode tab.
p
= 100 μs; square wave; T
Parameter
forward current
non-repetitive peak
reverse current
non-repetitive peak
reverse power dissipation
total power dissipation
junction temperature
ambient temperature
storage temperature
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
Limiting values
Thermal characteristics
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 7 December 2010
j
= 25 °C prior to surge.
Conditions
in free air
Conditions
T
amb
≤ 25 °C
Single Zener diodes in a SOD123F package
[1]
[2]
[3]
[1]
[2]
[3]
BZT52H series
Min
-
-
-
Min
-
-
-
-
-
-
−65
−65
Typ
-
-
-
Max
250
see
Table
and
40
375
830
150
+150
+150
© NXP B.V. 2010. All rights reserved.
10
Max
330
150
70
8,
9
Unit
mA
W
°C
°C
°C
mW
mW
2
2
Unit
K/W
K/W
K/W
.
.
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