BZT52H-B10 NXP [NXP Semiconductors], BZT52H-B10 Datasheet

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BZT52H-B10

Manufacturer Part Number
BZT52H-B10
Description
Single Zener diodes in a SOD123F package
Manufacturer
NXP [NXP Semiconductors]
Datasheet

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1. Product profile
2. Pinning information
1.1 General description
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
General-purpose Zener diodes in a SOD123F small and flat lead Surface-Mounted
Device (SMD) plastic package.
Table 1.
[1]
[2]
[3]
Table 2.
[1]
Symbol
V
P
Pin
1
2
F
tot
BZT52H series
Single Zener diodes in a SOD123F package
Rev. 3 — 7 December 2010
Total power dissipation: ≤ 830 mW
Wide working voltage range: nominal
2.4 V to 75 V (E24 range)
Small plastic package suitable for
surface-mounted design
General regulation functions
Pulse test: t
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
The marking bar indicates the cathode.
Parameter
forward voltage
total power dissipation
Quick reference data
Pinning
p
cathode
anode
Description
≤ 300 μs; δ ≤ 0.02.
I
T
Conditions
F
amb
= 10 mA
≤ 25 °C
[1]
Simplified outline
Low differential resistance
AEC-Q101 qualified
1
[1]
[2]
[3]
Min
-
-
-
2
Typ
-
-
-
Product data sheet
Graphic symbol
1
Max
0.9
375
830
006aaa152
2
Unit
V
mW
mW
.
2

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BZT52H-B10 Summary of contents

Page 1

... BZT52H series Single Zener diodes in a SOD123F package Rev. 3 — 7 December 2010 1. Product profile 1.1 General description General-purpose Zener diodes in a SOD123F small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features and benefits Total power dissipation: ≤ 830 mW Wide working voltage range: nominal 2 ...

Page 2

... BZT52H-B27 BZT52H-B4V7 DK BZT52H-B30 BZT52H-B5V1 DL BZT52H-B33 BZT52H-B5V6 DM BZT52H-B36 BZT52H-B6V2 DN BZT52H-B39 BZT52H-B6V8 DP BZT52H-B43 BZT52H-B7V5 DQ BZT52H-B47 BZT52H-B8V2 DR BZT52H-B51 BZT52H-B9V1 DS BZT52H-B56 BZT52H-B10 DT BZT52H-B62 BZT52H-B11 DU BZT52H-B68 BZT52H-B12 DV BZT52H-B75 BZT52H-B13 DW - BZT52H_SER Product data sheet Ordering information Package Name Description - plastic surface-mounted package; 2 leads [1] Marking Type number code DX ...

Page 3

... Parameter Conditions thermal resistance from in free air junction to ambient thermal resistance from junction to solder point All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 December 2010 BZT52H series Single Zener diodes in a SOD123F package Min Max - 250 - see Table and ...

Page 4

... NXP Semiconductors 7. Characteristics Table 7. ° Symbol V F [1] Pulse test: t Table 8. Characteristics per type; BZT52H-B2V4 to BZT52H-C24 ° unless otherwise specified. j BZT52H Sel Working Maximum differential -xxx voltage resistance Min Max I Z 2V4 B 2.35 2.45 400 C 2.2 2.6 2V7 B 2.65 2.75 500 C 2.5 2.9 3V0 B 2 ...

Page 5

... NXP Semiconductors Table 8. Characteristics per type; BZT52H-B2V4 to BZT52H-C24 ° unless otherwise specified. j BZT52H Sel Working Maximum differential -xxx voltage resistance Min Max I Z 9V1 B 8.92 9.28 100 C 8.5 9 9.8 10 9.4 10 10.8 11 10.4 11 11.8 12 11.4 12 12.7 13.3 110 C 12.4 14 14.7 15.3 110 C 13.8 15 ...

Page 6

... NXP Semiconductors Table 9. Characteristics per type; BZT52H-B27 to BZT52H-C51 ° unless otherwise specified. j BZT52H Sel Working Maximum differential -xxx voltage resistance Min Max 26.5 27.5 250 C 25.1 28 29.4 30.6 250 C 28.0 32 32.3 33.7 250 C 31.0 35 35.3 36.7 250 C 34.0 38 38.2 39.8 300 C 37.0 41 42.1 43.9 325 C 40.0 46 ...

Page 7

... 9V1 5 8V2 7V5 6V8 6V2 5V6 5V1 0 4V7 − BZT52H-B/C4V7 to BZT52H-B/C12 = 25 °C to 150 ° Temperature coefficient as a function of working current; typical values mbg781 1 V (V) F mbg782 (mA) Z © NXP B.V. 2010. All rights reserved ...

Page 8

... Package outline Fig 5. 10. Packing information Table 11. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BZT52H-B2V4 to BZT52H-C75 [1] For further information and the availability of packing methods, see BZT52H_SER Product data sheet 3.6 2 ...

Page 9

... Reflow soldering is the only recommended soldering method. Dimensions in mm. Reflow soldering footprint SOD123F All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 December 2010 BZT52H series Single Zener diodes in a SOD123F package solder lands solder resist 1.1 1.2 solder paste occupied area © ...

Page 10

... Product data sheet benefits”: amended. “Pinning”: graphic symbol updated. information”: added. information”: updated. Product data sheet Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 December 2010 BZT52H series Change notice Supersedes - BZT52H_SER v.2 - BZT52H_SER v © ...

Page 11

... Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 December 2010 BZT52H series Single Zener diodes in a SOD123F package © NXP B.V. 2010. All rights reserved ...

Page 12

... Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. Rev. 3 — 7 December 2010 BZT52H series Single Zener diodes in a SOD123F package © NXP B.V. 2010. All rights reserved ...

Page 13

... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com All rights reserved. Date of release: 7 December 2010 Document identifier: BZT52H_SER ...

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