S2083 MA-COM [M/A-COM Technology Solutions, Inc.], S2083 Datasheet - Page 8

• Manufacturer Part Number: S2083
• Description: Surface Mount Instructions for QFN / DFN Packages
• Manufacturer: MA-COM [M/A-COM Technology Solutions, Inc.]

8
Surface Mount Instructions for QFN / DFN Packages
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Application Note
S2083
Stencil Design
A stencil is used for applying solder paste to the
PCB.
Figures 1 through 2 will help eliminate some
surface mounting difficulties, special considerations
apply in stencil design and solder paste printing for
both lead pad and thermal pads.
Surface mount processes vary from company to
company, so we recommend careful development
of your process for QFN / DFN packages. The
following provides some guidelines for stencil
design.
We recommend a stencil thickness of 0.100 to
0.125 mm for fine pitch packages (0.5 mm or
smaller). This thickness can be increased to 0.15
mm for coarser pitch parts. A laser-cut, stainless
steel stencil with electro-polished trapezoidal walls
is recommended.
Although the PCB design suggested in
(not shown on right
view for clarity)
Figure 2-4 Solder Mask Design - cont.
4 x 6 mm PQFN - 32LD
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
The stencil opening for all lead pad areas should
be the same as the pad size on the PCB (Tables 1
& 2).
thermal pad is to allow for heat removal from the
package as well as providing an effective RF
ground. Therefore, a good stencil design becomes
important for getting an optimal older paste
distribution between the lead pads and the thermal
pad. To minimize voids and defects, use smaller
multiple stencil openings for the thermal pad
instead of one big opening. Figures 3-1 through 3-
3 shows the recommended stencil designs. The
target coverage for solder paste area is to maintain
50 to 80 percent of the overall thermal pad area.
The selected web width is 0.2 mm running across
the vias as shown in Figures 3-1 through 3-3.
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Rev. V10