S2083 MA-COM [M/A-COM Technology Solutions, Inc.], S2083 Datasheet - Page 14

• Manufacturer Part Number: S2083
• Description: Surface Mount Instructions for QFN / DFN Packages
• Manufacturer: MA-COM [M/A-COM Technology Solutions, Inc.]

14
Surface Mount Instructions for QFN / DFN Packages
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Application Note
S2083
Table 5. Pb-Free Process - Classification Temperature (T
Note 1: At the discretion of the device manufacturer, but not the board assembler/user, the maximum peak package body temperature (T
values specified in Tables 4 or 5. The use of a higher T
Note 2: Package volume excludes external terminals (e.g., balls, bumps, lands, leads) and/or nonintegral heat sinks.
Note 3: The maximum component temperature reached during reflow depends on package thickness and volume. The use of convection reflow processes
reduces the thermal gradients between packages. However, thermal gradients due to differences in thermal mass of SMD packages may still exist.
Note 4: Moisture sensitivity levels of components intended for use in a Pb-free assembly process shall be evaluated using the Pb-free classification
temperatures and profiles defined in Tables 3 and 5, whether or not Pb-free.
Note 5: SMD packages classified to a given moisture sensitivity level by using Procedures or Criteria defined within any previous version of J-STD-020,
JESD22-A112 (rescinded), IPC-SM-786 (rescinded) do not need to be reclassified to the current revision unless a change in classification level or a
higher peak classification temperature is desired
Figure 4. Reflow Profile
Package Thickness
1.6 mm-2.5 mm
<1.6 mm
>2.5 mm
Volume mm
260°C
260°C
250°C
p
does not change the classification temperature (T
3
<350
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
Volume mm
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Visit www.macomtech.com for additional data sheets and product information.
260°C
250°C
245°C
3
350-2000
C
c
).
)
• China Tel: [phone]
Volume mm
p
) can exceed the
260°C
245°C
245°C
3
>2000
Rev. V10