S2083 MA-COM [M/A-COM Technology Solutions, Inc.], S2083 Datasheet - Page 12

• Manufacturer Part Number: S2083
• Description: Surface Mount Instructions for QFN / DFN Packages
• Manufacturer: MA-COM [M/A-COM Technology Solutions, Inc.]

12
Surface Mount Instructions for QFN / DFN Packages
ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions
is considering for development. Performance is based on target specifications, simulated results,
and/or prototype measurements. Commitment to develop is not guaranteed.
PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology
Solutions has under development. Performance is based on engineering tests. Specifications are
typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available.
Commitment to produce in volume is not guaranteed.
Application Note
S2083
Reflow Profile
The most common solder reflow method is
accomplished in a belt furnace using convection
heat transfer. Tables 3 thru 5 along with Figure 4
show a typical convection reflow profile of
temperature versus time. The profile reflects the
three distinct heating stages, or zones (preheat,
reflow, and cooling) recommended in automated
reflow processes to ensure reliable, finished solder
joints.
systems and is intended as an example to use as a
starting point.
profile include the density and types of components
on the board, type of solder used and type of board
or substrate material being used.
Thermocouples should be securely attached to the
top surface of a representative component to
insure the temperature exposure is met.
should be recorded by data acquisition for future
reference.
The profile will vary among soldering
Other factors that can affect the
Profile
M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make
changes to the product(s) or information contained herein without notice.
General Soldering Precautions
The melting temperature of solder generally
exceeds the recommended maximum operating
temperature of the device. When the entire device
is heated to a high temperature, failure to complete
soldering within a short time could result in device
failure.
instructions to minimize the thermal stress to the
devices.
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Always preheat the device (failure to do so can
cause excessive thermal shock and stress that
can result in damage to the device).
Limit the temperature in the reflow stage to peak
temperature indicated in Tables 3 thru 5.
After completing the soldering process, allow the
devices to cool naturally for at least 3 minutes.
Gradual cooling should be used, as the use of
forced cooling will increase the temperature
gradient and may result in latent failure due to
mechanical stress.
Avoid any mechanical stress or shock to the
solder joints and devices during cooling.
Therefore, always observe the following
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Rev. V10