L6100200 SEMIKRON [Semikron International], L6100200 Datasheet - Page 2

• Manufacturer Part Number: L6100200
• Description: SKYPER 32PRO
• Manufacturer: SEMIKRON [Semikron International]

SKYPER™ 32PRO -
Application and Handling Instructions
Further application support
Latest information is available at http://www.semikron.com. For design support please read the SEMIKRON
Application Manual Power Modules available at http://www.semikron.com.
General Description
The SKYPER™ 32PRO core constitutes an interface between IGBT modules and the controller. This core is a
half bridge driver. Functions for driving, potential separation and protection are integrated in the driver. Thus it can
be used to build up a driver solution for IGBT modules.
Features of SKYPER™ 32PRO
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Please note:
All values in this technical explanation are typical values. Typical values are the average values expected in large
quantities and are provided for information purposes only. These values can and do vary in different applications. All
operating parameters should be validated by user’s technical experts for each application.
Please provide for static discharge protection during handling. As long as the hybrid driver is not completely
assembled, the input terminals have to be short-circuited. Persons working with devices have to wear a
grounded bracelet. Any synthetic floor coverings must not be statically chargeable. Even during
transportation the input terminals have to be short-circuited using, for example, conductive rubber.
Worktables have to be grounded. The same safety requirements apply to MOSFET- and IGBT-modules.
Any parasitic inductances within the DC-link have to be minimised. Over-voltages may be absorbed by C- or
RCD-snubbers between main terminals for PLUS and MINUS of the power module.
When first operating a newly developed circuit, SEMIKRON recommends to apply low collector voltage and
load current in the beginning and to increase these values gradually, observing the turn-off behaviour of the
free-wheeling diode and the turn-off voltage spikes generated across the IGBT. An oscillographic control will
be necessary. Additionally, the case temperature of the module has to be monitored. When the circuit works
correctly under rated operation conditions, short-circuit testing may be done, starting again with low collector
voltage.
It is important to feed any errors back to the control circuit and to switch off the device immediately in failure
events. Repeated turn-on of the IGBT into a short circuit with a high frequency may destroy the device.
The inputs of the hybrid driver are sensitive to over-voltage. Voltages higher than V
may destroy these inputs. Therefore, control signal over-voltages exceeding the above values have to be
avoided.
The connecting leads between hybrid driver and the power module should be as short as possible (max.
20cm), the driver leads should be twisted.
Two output channels
Integrated potential free power supply for secondary side
Short Pulse Suppression (SPS)
Under Voltage Protection (UVP) primary & secondary
Under Voltage Reset (UVR)
Drive interlock (dead time) top / bottom (DT) adjustable
Dynamic Short Circuit Protection (DSCP) by V
direct switch off
Soft Turn-Off (STO)
Halt Logic Signal (HLS)
Failure Management
External Error Input
DC bus voltage up to 1200V
Coated with varnish
Technical Explanations
2005-06-03 – Rev02
CE
monitoring and
SKYPER™ 32PRO
S
+0,3V or below -0,3V
© by SEMIKRON