L6100200 SEMIKRON [Semikron International], L6100200 Datasheet - Page 15

• Manufacturer Part Number: L6100200
• Description: SKYPER 32PRO
• Manufacturer: SEMIKRON [Semikron International]

SKYPER™ 32PRO -
Mounting Notes
The connection between driver core and printed circuit board should be mechanical reinforced by using support
posts.
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Soldering Hints
The temperature of the solder must not exceed 260°C, and solder time must
not exceed 10 seconds.
The ambient temperature must not exceed the specified maximum storage
temperature of the driver.
The solder joints should be in accordance to IPC A 610 Revision D (or later) -
Class 3 (Acceptability of Electronic Assemblies) to ensure an optimal
connection between driver core and printed circuit board.
Use of Support Posts
Please note:
The driver is not suited for hot air reflow or infrared reflow processes.
Please note:
The use of agressive materials in cleaning process of driver core may be detrimental for the device parameters.
Technical Explanations
2005-06-03 – Rev02
Product information of suitable support posts and
distributor contact information is available at e.g.
http://www.richco-inc.com
Drill Hole & Pad Size in mm
(e.g. series MSPM).
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