ax5031 AXSEM, ax5031 Datasheet - Page 35

• Manufacturer Part Number: ax5031
• Description: Datasheet Ax5031
• Manufacturer: AXSEM

6.
7.
Version 1.3
The fine pitch of the IC leads requires accurate alignment of the stencil and the printed
circuit board. The stencil and printed circuit assembly should be aligned to within + 1 mil
prior to application of the solder paste.
No-clean flux is recommended since flux from underneath the thermal pad will be
difficult to clean if water-soluble flux is used.
50% coverage
Minimum
Figure 10: Solder paste application on exposed pad
Figure 11: Solder paste application on pins
62 % coverage
QFN20 Package Information
80% coverage
Maximum
Datasheet AX5031
35