ax5031 AXSEM, ax5031 Datasheet - Page 33

• Manufacturer Part Number: ax5031
• Description: Datasheet Ax5031
• Manufacturer: AXSEM

8.2.
25°C
Version 1.3
T
T
T
T
p
L
sMAX
sMIN
QFN Soldering Profile
Notes:
Profile Feature
Average Ramp-Up Rate
Preheat Preheat
Temperature Min
Temperature Max
Time (T
Time 25°C to Peak Temperature
Reflow Phase
Liquidus Temperature
Time over Liquidus Temperature
Peak Temperature
Time within 5°C of actual Peak
Temperature
Cooling Phase
Ramp-down rate
sMIN
All temperatures refer to the top side of the package, measured on the package body surface.
to T
sMAX
Preheat
)
t
s
t
25° to Peak
T
T
t
T
T
t
t
T
p
s
L
sMIN
sMAX
25 ° to Peak
L
p
Time
Pb-Free Process
3°C/sec max.
150°C
200°C
60 – 180 sec
8 min max.
217°C
60 – 150 sec
260°C
20 – 40 sec
6°C/sec max.
t
L
Reflow
QFN20 Package Information
t
p
Datasheet AX5031
Cooling
33