mt58l64v32f Micron Semiconductor Products, mt58l64v32f Datasheet - Page 22
mt58l64v32f
Manufacturer Part Number
mt58l64v32f
Description
2mb 128k X 18, 64k X 32/36 Flow-through Syncburst Sram
Manufacturer
Micron Semiconductor Products
Datasheet
1.MT58L64V32F.pdf
(24 pages)
- Current page: 22 of 24
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2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM
MT58L128L18F_2.p65 – Rev. 8/00
15.00 ±0.10
NOTE: 1. All dimensions in millimeters MAX or typical where noted.
165X Ø 0.45
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.
BALL A11
7.50 ±0.05
7.00 ±0.05
0.85 ±0.075
5.00 ±0.05
13.00 ±0.10
10.00
MIN
6.50 ±0.05
(TYP)
1.00
165-PIN FBGA
A
(TYP)
1.00
BALL A1
PIN A1 ID
14.00
22
FLOW-THROUGH SYNCBURST SRAM
SEATING PLANE
0.10 A
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
2Mb: 128K x 18, 64K x 32/36
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb
SOLDER BALL PAD: Ø .33mm
PIN A1 ID
©2000, Micron Technology, Inc.
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