mt58l64v32f Micron Semiconductor Products, mt58l64v32f Datasheet - Page 11

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mt58l64v32f

Manufacturer Part Number
mt58l64v32f
Description
2mb 128k X 18, 64k X 32/36 Flow-through Syncburst Sram
Manufacturer
Micron Semiconductor Products
Datasheet
TQFP CAPACITANCE
TQFP THERMAL RESISTANCE
NOTE: 1. This parameter is sampled.
2Mb: 128K x 18, 64K x 32/36 Flow-Through SyncBurst SRAM
MT58L128L18F_2.p65 – Rev. 6/01
DESCRIPTION
Control Input Capacitance
Input/Output Capacitance (DQ)
Address Capacitance
Clock Capacitance
DESCRIPTION
Thermal Resistance
(Junction to Ambient)
Thermal Resistance
(Junction to Top of Case)
Test conditions follow standard test methods
and procedures for measuring thermal
T
A
impedance, per EIA/JESD51.
= 25°C; f = 1 MHz;
CONDITIONS
V
DD
CONDITIONS
= 3.3V
11
FLOW-THROUGH SYNCBURST SRAM
SYMBOL
Micron Technology, Inc., reserves the right to change products or specifications without notice.
C
2Mb: 128K x 18, 64K x 32/36
C
C
C
CK
O
A
I
TYP
2.7
2.5
2.5
4
SYMBOL
θ
θ
JA
JC
MAX
3.5
3.5
3.5
5
TYP
40
8
UNITS
p F
p F
p F
p F
UNITS NOTES
©2000, Micron Technology, Inc.
°C/W
°C/W
NOTES
1
1
1
1
1
1

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