tga2509-epu-fl TriQuint Semiconductor, tga2509-epu-fl Datasheet - Page 3

• Manufacturer Part Number: tga2509-epu-fl
• Description: Wideband Packaged Hpa With Agc
• Manufacturer: TriQuint Semiconductor

TriQuint Semiconductor Texas Phone: [phone] Fax: [phone] Email: [e-mail] Web: www.triquint.com
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
Note: Package attached with mounting hardware and metal shim (Al or In) to
carrier at 65 C baseplate temperature. Worst case is at saturated output power
when DC power consumption rises to 15 W with 1 W RF power delivered to load.
Power dissipated is 14 W and the temperature rise in the channel is 90 C.
Baseplate temperature must be reduced to 60 C to remain below the 150 C
maximum channel temperature.
SYMBOL
R
Resistance
(channel to backside
of package)
R
Resistance
(channel to backside
of package)
JC
JC
Gain
ORL
P
IRL
1dB
Parameter
Thermal
Thermal
Output Return Loss
Small Signal Gain
Input Return Loss
Output Power @
PARAMETER
Compression
1dB Gain
Vd = 12 V
I
Pdiss = 13.2 W
(without using AGC)
Vd = 12 V
I
Pdiss = 10.6 W
(when using AGC)
RF CHARACTERIZATION TABLE
D
D
THERMAL INFORMATION
= 1.08 A
= 0.88 A
Test Conditions
Vd = 12 V, Id = 1.08 A
(T
A
= 25 C, Nominal)
TABLE III
TABLE II
f = 2-20 GHz
f = 2-20 GHz
f = 2-20 GHz
f = 2-20 GHz
CONDITION
TEST
Advance Product Information
(
150
150
T
o
CH
C)
NOMINAL
( C/W)
R
15
29
10
12
6.4
8.3
T
JC
(HRS)
1 E+6
1 E+6
September 15, 2004
TGA2509-EPU-FL
UNITS
T
dBm
M
dB
dB
dB
3