tga2509-epu-fl TriQuint Semiconductor, tga2509-epu-fl Datasheet - Page 12

• Manufacturer Part Number: tga2509-epu-fl
• Description: Wideband Packaged Hpa With Agc
• Manufacturer: TriQuint Semiconductor

TriQuint Semiconductor Texas Phone: [phone] Fax: [phone] Email: [e-mail] Web: www.triquint.com
Manual Assembly for Prototypes
1. Clean the motherboard or the similar module with Acetone. Rinse with alcohol and DI water. Allow the circuit
2. To improve the thermal and RF performance, TriQuint recommends using two # 0-80 bolts to attach a heat
3. Apply Tin/Lead solder, or equivalent, to each active pin of the TGA2509.
4 Clean the assembly with alcohol.
GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process
specifications. Specifications are subject to change without notice.
Assembly of a TGA2509-EPU Flange Mount Package onto a Motherboard
to fully dry.
sink to the bottom of the package with an indium alloy preform, or equivalent, between the two.
TG2509-EPU-FL
Part
Ordering Information
Flange (Leads bolted down)
Package Style
Advance Product Information
TGA2509-EPU-FL
September 15, 2004
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