ppc440epx Applied Micro Circuits Corporation (AMCC), ppc440epx Datasheet - Page 20
ppc440epx
Manufacturer Part Number
ppc440epx
Description
Powerpc 440epx Embedded Processor
Manufacturer
Applied Micro Circuits Corporation (AMCC)
Datasheet
1.PPC440EPX.pdf
(96 pages)
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440EPx – PPC440EPx Embedded Processor
Assembly Recommendations
Table 3. Recommended Reflow Soldering Profile
Table 4. JEDEC Moisture Sensitivity Level and Ball Composition
20
Average ramp-up rate
Preheat
Time Maintained Above:
Peak Temperature
Time within 5°C of Actual Peak Temperature
Ramp-down Rate
Time 25°C to Peak Temperature
MSL Level
Solder Ball Metallurgy
• Temperature Min
• Temperature Max
• Time (min to max)
• Temperature
• Time
Profile Feature
3
63Sn/37Pb
3°C/Second Max
100°C
150°C
60-120 Seconds
183°C
60-150 Seconds
225 +0/-5°C
10-30 Seconds
6°C/Second Max
6 Minutes Max
Sn-Pb Eutectic Assembly
Sn-Pb Eutectic Assembly
3°C/Second Max
150°C
180°C
60-120 Seconds
230°C
30-50 Seconds
260 +5/-0°C
10-20 Seconds
6°C/Second Max
8 Minutes Max
Preliminary Data Sheet
3
Sn/4Ag/05Cu
Pb Free Reflow Assemble
Revision 1.29 – July 22, 2008
Pb Free Reflow Assembly
AMCC Proprietary