mt9v034c12stmdes aptina, mt9v034c12stmdes Datasheet - Page 80

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mt9v034c12stmdes

Manufacturer Part Number
mt9v034c12stmdes
Description
1/3-inch Wide-vga Cmos Digital Image Sensor
Manufacturer
aptina
Datasheet
Package Dimensions
Figure 47:
PDF: 09005aef8366edcb/Source: 09005aef8366ede5
MT9V034_DS - Rev. A 10/08 EN
0.40 ±0.05
Seating
8.8
4X
48X
plane
1.0 ±0.2
47X
4.4
0.2
D
A
48-Pin CLCC Package Outline Drawing
Notes:
over Ni plating, 1.27 microns
5.215
Au plating, 0.50 microns
4.4
minimum thickness
minimum thickness
11.43
48
8.8
1. All dimensions in millimeters.
2. Optical center = Package center.
1
Lead finish:
TYP
0.8
5.715
0.8 TYP
Aptina Confidential and Proprietary
1.7
B
1.75
5.715
4.84
48X R 0.15
5.215
1.400 ±0.125
for reference only
for reference only
2.3 ±0.2
11.43
C
80
A
0.90
0.35
0.05
MT9V034: 1/3-Inch Wide-VGA Digital Image Sensor
Substrate material: alumina ceramic 0.7 thickness
Wall material: alumina ceramic
Lid material: borosilicate glass 0.55 thickness
Image
sensor die:
0.675 thickness
0.10 A
Ø0.20 A B C
V CTR
Optical
Optical area:
Maximum rotation of optical area relative to package edges: 1º
Maximum tilt of optical area relative to
Maximum tilt of optical area relative to
Note: 1. Optical center = package center.
Aptina Imaging reserves the right to change products or specifications without notice.
area
seating plane A : 50 microns
top of cover glass D : 100 microns
©2008 Aptina Imaging Corporation. All rights reserved.
Ø0.20 A B C
10.9 ±0.1
H CTR
CTR
Package Dimensions
Optical
center
10.9 ±0.1
First
clear
pixel
CTR
1

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