m470l6423en0-cb3 Samsung Semiconductor, Inc., m470l6423en0-cb3 Datasheet - Page 9
![no-image](/images/no-image-200.jpg)
m470l6423en0-cb3
Manufacturer Part Number
m470l6423en0-cb3
Description
512mb Unbuffered Sodimm Based On Stsop
Manufacturer
Samsung Semiconductor, Inc.
Datasheet
1.M470L6423EN0-CB3.pdf
(13 pages)
512MB Unbuffered SODIMM(based on sTSOP)
AC Timming Parameters & Specifications
Row cycle time
Refresh row cycle time
Row active time
RAS to CAS delay
Row precharge time
Row active to Row active delay
Write recovery time
Last data in to Read command
Col. address to Col. address delay
Clock cycle time
Clock high level width
Clock low level width
DQS-out access time from CK/CK
Output data access time from CK/CK
Data strobe edge to ouput data edge
Read Preamble
Read Postamble
CK to valid DQS-in
DQS-in setup time
DQS-in hold time
DQS falling edge to CK rising-setup time
DQS falling edge from CK rising-hold time
DQS-in high level width
DQS-in low level width
DQS-in cycle time
Address and Control Input setup time(fast)
Address and Control Input hold time(fast)
Address and Control Input setup time(slow)
Address and Control Input hold time(slow)
Data-out high impedence time from CK/CK
Data-out low impedence time from CK/CK
Input Slew Rate(for input only pins)
Input Slew Rate(for I/O pins)
Output Slew Rate(x4,x8)
Output Slew Rate Matching Ratio(rise to fall)
Parameter
CL=2.0
CL=2.5
Symbol
tDQSCK
tWPRES
tWPRE
tDQSQ
tRPRE
tDQSS
tDQSH
tSL(IO)
tSLMR
tRPST
tDQSL
tSL(O)
tRRD
tWTR
tCCD
tRFC
tRAS
tRCD
tDSS
tDSH
tDSC
tSL(I)
tWR
tRC
tRP
tCH
tCK
tCL
tAC
tHZ
tLZ
tIS
tIH
tIS
tIH
(DDR333@CL=2.5))
Min
0.45
0.45
0.75
0.25
0.35
0.35
0.75
0.75
0.67
-0.6
-0.7
-0.7
-0.7
7.5
0.9
0.4
0.2
0.2
0.9
0.8
0.8
0.5
0.5
1.0
60
72
42
18
18
12
15
1
1
6
0
-
B3
Max
0.55
0.55
+0.6
+0.7
0.45
1.25
+0.7
+0.7
70K
1.1
0.6
1.1
4.5
1.5
12
12
(DDR266@CL=2.0)
-0.75
-0.75
-0.75
-0.75
Min
0.45
0.45
0.75
0.25
0.35
0.35
0.67
7.5
7.5
0.9
0.4
0.2
0.2
0.9
0.9
0.9
1.0
1.0
0.5
0.5
1.0
65
75
45
20
20
15
15
1
1
0
-
A2
+0.75
+0.75
120K
+0.75
+0.75
Max
0.55
0.55
1.25
0.5
1.1
0.6
1.1
4.5
1.5
12
12
(DDR266@CL=2.5))
-0.75
-0.75
-0.75
-0.75
Min
0.45
0.45
0.75
0.25
0.35
0.35
0.67
7.5
0.9
0.4
0.2
0.2
0.9
0.9
0.9
1.0
1.0
0.5
0.5
1.0
65
75
20
20
15
15
10
45
1
1
0
-
Rev. 1.3 March. 2004
B0
+0.75
+0.75
120K
Max
+0.75
+0.75
0.55
0.55
1.25
0.5
1.1
0.6
1.1
4.5
1.5
12
12
DDR SDRAM
Unit
V/ns
V/ns
V/ns
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
tCK
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
i,5.7~9
i,5.7~9
Note
i, 6~9
i, 6~9
12
3
1
1