m393b1k70bh1 Samsung Semiconductor, Inc., m393b1k70bh1 Datasheet - Page 3

• Manufacturer Part Number: m393b1k70bh1
• Description: Ddr3 Sdram
• Manufacturer: Samsung Semiconductor, Inc.

15.0 IDD specification definition.................................................................................................................................... 29
16.0 Input/Output Capacitance ...................................................................................................................................... 34
17.0 Electrical Characteristics and AC timing.............................................................................................................. 35
18.0 Timing Parameters for DDR3-800, DDR3-1066 and DDR3-1333.......................................................................... 38
19.0 Physical Dimensions : ........................................................................................................................................... 43
Registered DIMM
15.1 IDD SPEC Table................................................................................................................................................. 31
17.1 Refresh Parameters by Device Density .......................................................................................................... 35
17.2 Speed Bins and CL, tRCD, tRP, tRC and tRAS for Corresponding Bin ....................................................... 35
17.3 Speed Bins and CL, tRCD, tRP, tRC and tRAS for corresponding Bin........................................................ 36
18.1 Jitter Notes ........................................................................................................................................................ 41
18.2 Timing Parameter Notes................................................................................................................................... 42
19.1 256Mbx8 based 512Mx72 Module(2 Ranks)................................................................................................... 43
19.2 512Mbx4 based 512Mx72 Module(1 Ranks)................................................................................................... 44
19.3 512Mbx4 based 1Gx72 Module(2 Ranks) ....................................................................................................... 45
19.4 256Mbx8 based 1Gx72 Module(4 Ranks) ....................................................................................................... 48
19.5 16GB based 2Gx72 Module(4 Ranks)............................................................................................................. 49
17.3.1 Speed Bin Table Notes ............................................................................................................................ 37
19.1.1 x72 DIMM, populated as one physical ranks of x8 DDR3 SDRAMs.................................................... 43
19.2.1 x72 DIMM, populated as one physical ranks of x4 DDR3 SDRAMs.................................................... 44
19.3.1 x72 DIMM, populated as one physical ranks of x4 DDR3 SDRAMs.................................................... 45
19.3.2 Heat Spreader Design Guide ................................................................................................................. 46
19.4.1 x72 DIMM, populated as one physical ranks of x8 DDR3 SDRAMs.................................................... 48
19.6.1 x72 DIMM, populated as one physical ranks of x8 DDR3 SDRAMs.................................................... 49
19.6.2 Heat Spreader Design Guide ................................................................................................................. 50
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Rev. 1.0 December 2008
DDR3 SDRAM