mt18vdvf6472d Micron Semiconductor Products, mt18vdvf6472d Datasheet - Page 31
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mt18vdvf6472d
Manufacturer Part Number
mt18vdvf6472d
Description
Ddr Sdram Vlp Registered Dimm
Manufacturer
Micron Semiconductor Products
Datasheet
1.MT18VDVF6472D.pdf
(38 pages)
Temperature and Air Flow Specifications
Figure 11:
PDF: 09005aef81c73825/Source: 09005aef81c73837
DVF18C64_128x72D_2.fm - Rev. A 8/05 EN
100
90
80
70
60
50
40
30
20
Component Case Temperature vs. Air Flow
Notes: 1. Micron Technology, Inc. recommends a minimum air flow of 1 meter/second (~197 LFM)
2. The component case temperature measurements shown above were obtained experimen-
3. Temperature versus air speed data is obtained by performing experiments with the system
4. The memory diagnostic software used for determining worst-case component tempera-
across all modules.
tally. The typical system to be used for experimental purposes is a dual-processor 600 MHz
work station, fully loaded, with four comparable registered memory modules. Case tem-
peratures charted represent worst-case component locations on modules installed in the
internal slots of the system.
motherboard removed from its case and mounted in a Eiffel-type low air speed wind tun-
nel. Peripheral devices installed on the system motherboard for testing are the proces-
sor(s) and video card, all other peripheral devices are mounted outside of the wind tunnel
test chamber.
tures is a memory diagnostic software application developed for internal use by Micron
Technology, Inc.
T
T
max
ave
- memory stress software
- memory stress software
T
ave
Air Flow (meters/sec)
- 3D gaming software
512MB, 1GB: (x72, DR) 184-Pin DDR VLP RDIMM
31
Temperature and Air Flow Specifications
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Ambient Temperature = 25º C
Minimum Air Flow
©2003, 2004, 2005 Micron Technology, Inc. All rights reserved.