mt18vddt12872ag-40b Micron Semiconductor Products, mt18vddt12872ag-40b Datasheet - Page 11

• Manufacturer Part Number: mt18vddt12872ag-40b
• Description: 256mb, 512mb, 1gb, 2gb X72, Ecc, Dr 184-pin Ddr Sdram Udimm
• Manufacturer: Micron Semiconductor Products

Table 13:
PDF: 09005aef80814e61/Source: 09005aef807f8acb
DD18C32_64_128_256x72A.fm - Rev. C 10/07 EN
Parameter/Condition
Operating one bank active-precharge current:
t
Address and control inputs changing once every two clock cycles
Operating one bank active-read-precharge current: BL = 2;
t
changing once per clock cycle
Precharge power-down standby current: All device banks idle;
Power-down mode;
Idle standby current: CS# = HIGH; All device banks idle;
t
once per clock cycle; V
Active power-down standby current: One device bank active; Power-
down mode;
Active standby current: CS# = HIGH; CKE = HIGH; One device bank;
Active precharge;
inputs changing twice per clock cycle; Address and other control inputs
changing once per clock cycle
Operating burst read current: BL = 2; Continuous burst reads; One
device bank active; Address and control inputs changing once per clock
cycle;
Operating burst write current: BL = 2; Continuous burst writes; One
device bank active; Address and control inputs changing once per clock
cycle;
cycle
Auto refresh current
Self refresh current: CKE ≤ 0.2V
Operating bank interleave read current: Four device bank
interleaving reads; BL = 4 with auto precharge;
t
READ or WRITE commands
CK =
RC =
CK =
CK =
t
t
t
t
t
t
RC (MIN);
CK (MIN); DQ, DM, and DQS inputs changing once per clock cycle;
CK (MIN); CKE = HIGH; Address and other control inputs changing
CK =
CK =
CK (MIN); Address and control inputs change only during active
t
t
CK (MIN); DQ, DM, and DQS inputs changing twice per clock
CK (MIN); I
t
I
Values are shown for the MT46V64M8 DDR SDRAM only and are computed from values specified in the
512Mb (64 Meg x 8) component data sheet
CK =
DD
t
CK =
t
Specifications and Conditions – 1GB
RC =
t
Notes:
CK (MIN); CKE = LOW
t
CK =
IN
t
CK (MIN); I
OUT
= V
t
RAS (MAX);
t
CK (MIN); CKE = LOW
REF
= 0mA
1. Value calculated as one module rank in this operating condition; all other module ranks are
2. Value calculated reflects all module ranks in this operating condition.
for DQ, DQS, and DM
in I
OUT
256MB, 512MB, 1GB, 2GB (x72, ECC, DR) 184-Pin DDR SDRAM UDIMM
DD
t
2P (CKE LOW) mode.
CK =
= 0mA; Address and control inputs
t
CK (MIN); DQ, DM, and DQS
t
RC =
t
t
t
RC =
REFC =
REFC = 7.8125µs
t
RC (MIN);
t
RC (MIN);
t
11
RFC (MIN)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Symbol -40B
I
I
I
I
I
I
I
DD
DD
DD
I
I
DD
I
I
I
DD
DD
DD
DD
DD
DD
DD
DD
4W
3N
5A
4R
2P
2F
3P
0
1
5
6
7
1
1
2
2
1
2
2
2
1
2
2
1
1,440
1,710
1,080
1,755
1,800
6,210
4,095
990
810
198
90
90
Electrical Specifications
1,215
1,485
1,530
1,620
5,220
3,690
-335
900
810
630
180
90
90
©2004 Micron Technology, Inc. All rights reserved.
1,215
1,485
1,530
1,440
5,220
3,645
-262
810
630
900
180
90
90
-26A/
1,080
1,350
1,350
1,260
5,040
3,195
-265
720
540
810
180
90
90
Units
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA