mt18vddt12872ag-335 Micron Semiconductor Products, mt18vddt12872ag-335 Datasheet - Page 24

• Manufacturer Part Number: mt18vddt12872ag-335
• Description: 256mb, 512mb, 1gb, 2gb X72, Ecc, Dr 184-pin Ddr Sdram Udimm
• Manufacturer: Micron Semiconductor Products

NOTE:
pdf: 09005aef80814e61, source: 09005aef807f8acb
DD18C32_64_128_256x72AG.fm - Rev. B 9/04 EN
1. Micron Technology, Inc. recommends a minimum air flow of 1 meter/second (~197 LFM) across the module when
2. The component case temperature measurements shown above were obtained experimentally. The typical system to
3. Temperature versus air speed data is obtained by performing experiments with the system motherboard removed
4. The memory diagnostic software used for determining worst-case component temperatures is a memory diagnostic
installed in a system.
be used for experimental purposes is a dual-processor 600 MHz work station, fully loaded, with four comparable
registered memory modules. Case temperatures charted represent worst-case component locations on modules
installed in the internal slots of the system.
from its case and mounted in a Eiffel-type low air speed wind tunnel. Peripheral devices installed on the system
motherboard for testing are the processor(s) and video card, all other peripheral devices are mounted outside of
the wind tunnel test chamber.
software application developed for internal use by Micron Technology, Inc.
100
90
80
70
60
50
40
30
20
Figure 11: Component Case Temperature Vs. Air Flow
T
T
max
ave
- memory stress software
- memory stress software
T
256MB, 512MB, 1GB, 2GB (x72, ECC, DR)
ave
Air Flow (meters/sec)
- 3D gaming software
24
Micron Technology, Inc., reserves the right to change products or specifications without notice.
184-PIN DDR SDRAM UDIMM
Ambient Temperature = 25º C
Minimum Air Flow
©2004 Micron Technology, Inc. All rights reserved.