s72ns512rd0khfm0 Meet Spansion Inc., s72ns512rd0khfm0 Datasheet - Page 9
![no-image](/images/no-image-200.jpg)
s72ns512rd0khfm0
Manufacturer Part Number
s72ns512rd0khfm0
Description
Mirrorbit Flash Memory And Dram128/256/512 Mb 8/16/32 M X 16 Bit , 1.8 Volt-onlymultiplexed Simultaneous Read/writeburst Mode Flash Memory128/256 Mb 8/16 M X 16 Bit Ddr Dram On Split Bus
Manufacturer
Meet Spansion Inc.
Datasheet
1.S72NS512RD0KHFM0.pdf
(13 pages)
6.
6.1
May 9, 2008 S72NS-R_00_05
Physical Dimensions
RLB133—133-ball Fine-Pitch Ball Grid Array (FBGA) 8.0 x 8.0 mm
PACKAGE
SYMBOL
SD / SE
JEDEC
D x E
MD
ME
A1
A2
D1
E1
Øb
D
N
A
E
e
0.80
0.18
0.62
7.90
7.90
0.25
MIN
D a t a
D5-D11, E4-E11, F4-F11
G4-G11, H4-H11, J4-J11
8.0 mm x 8.00 mm
K4-K11, L4-L11
PACKAGE
6.50 BSC.
6.50 BSC.
0.50 BSC.
0.25 BSC.
RLB 133
NOM
0.90
0.23
0.68
8.00
8.00
0.30
N/A
133
14
14
S h e e t
MAX
1.00
0.28
0.74
8.10
8.10
0.35
OVERALL THICKNESS
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
( A d v a n c e
NOTE
S72NS-R Based MCPs
I n f o r m a t i o n )
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
3627 \ 16-039.63 \ 8.21.7
9